Inventor · disambiguated record
Yuhei Horikawa
Also filed as: HORIKAWA YUHEI
26 granted patents·5 pending applications·36 citations·filing 2011–2021
93Inventor score
Top patents by PatentIndex Score
31 records- 0193US9818736B1Method for producing semiconductor packageTDK CORP·Filed 2017·Granted Nov 14, 2017·11 cites·4 claims
- 0292US11031330B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2020·Granted Jun 8, 2021·3 cites·13 claims
- 0384US11869834B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2021·Granted Jan 9, 2024·1 cites·12 claims
- 0483US10867898B2Electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2018·Granted Dec 15, 2020·3 cites·13 claims
- 0583US10374301B2Wiring componentTDK CORP·Filed 2017·Granted Aug 6, 2019·4 cites·9 claims
- 0673US8933336B2Coating and electronic componentTDK CORP·Filed 2012·Granted Jan 13, 2015·3 cites·7 claims
- 0772US9257402B2Terminal structure, and semiconductor element and module substrate comprising the sameTDK CORP·Filed 2013·Granted Feb 9, 2016·3 cites·7 claims
- 0868US9070606B2Terminal structure and semiconductor deviceTDK CORP·Filed 2013·Granted Jun 30, 2015·2 cites·6 claims
- 0968US8692127B2Terminal structure, printed wiring board, module substrate, and electronic deviceHORIKAWA YUHEI·Filed 2011·Granted Apr 8, 2014·3 cites·6 claims
- 1066US9640500B2Terminal structure and semiconductor deviceTDK CORP·Filed 2013·Granted May 2, 2017·2 cites·9 claims
- 1163US11410855B2Method of producing electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2020·Granted Aug 9, 2022·0 cites·13 claims
- 1261US8976076B2High-frequency transmission line, antenna, and electronic circuit boardTDK CORP·Filed 2013·Granted Mar 10, 2015·1 cites·14 claims
- 1360US11668008B2Sheet material, metal mesh, wiring substrate, display device and manufacturing methods thereforTDK CORP·Filed 2020·Granted Jun 6, 2023·0 cites·11 claims
- 1460US2024047695A1Layered body, negative electrode current collector for lithium ion secondary battery, and negative electrode for lithium ion secondary batteryTDK CORP·Filed 2021·Application pending·0 cites
- 1560US2024072239A1Multilayer body, negative electrode collector for lithium ion secondary batteries, and negative electrode for lithium ion secondary batteriesTDK CORP·Filed 2021·Application pending·0 cites
- 1660US2024047694A1Layered body, negative electrode current collector for lithium ion secondary battery, and negative electrode for lithium ion secondary batteryTDK CORP·Filed 2021·Application pending·0 cites
- 1755US10354973B2Method for producing semiconductor chipTDK CORP·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 1853US10784122B2Method of producing electroconductive substrate, electronic device and display deviceTDK CORP·Filed 2018·Granted Sep 22, 2020·0 cites·10 claims
- 1953US8787028B2Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structureTDK CORP·Filed 2012·Granted Jul 22, 2014·0 cites·11 claims
- 2052US10163847B2Method for producing semiconductor packageTDK CORP·Filed 2017·Granted Dec 25, 2018·0 cites·19 claims
- 2151US10968519B2Sheet material, metal mesh, wiring substrate, display device and manufacturing methods thereforTDK CORP·Filed 2018·Granted Apr 6, 2021·0 cites·2 claims
- 2250US11466368B2Sheet material, metal mesh and manufacturing methods thereofTDK CORP·Filed 2018·Granted Oct 11, 2022·0 cites·15 claims
- 2350US10392704B2Coating electronic componentTDK CORP·Filed 2017·Granted Aug 27, 2019·0 cites·12 claims
- 2450US2013192873A1Structure body and electronic component and printed wiring board including the sameTDK CORP·Filed 2012·Application pending·0 cites
- 2549US10205250B2Junction structure for an electronic device and electronic deviceTDK CORP·Filed 2014·Granted Feb 12, 2019·0 cites·11 claims
- 2649US9177687B2Coating and electronic componentTDK CORP·Filed 2012·Granted Nov 3, 2015·0 cites·17 claims
- 2747US8970037B2Terminal structure, and semiconductor element and module substrate comprising the sameTDK CORP·Filed 2013·Granted Mar 3, 2015·0 cites·5 claims
- 2846US10304779B2Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereofTDK CORP·Filed 2017·Granted May 28, 2019·0 cites·7 claims
- 2946US2012018191A1Coating and electronic componentYOSHIDA KENICHI·Filed 2011·Application pending·0 cites
- 3039US10354796B2Method for manufacturing planar coilTDK CORP·Filed 2017·Granted Jul 16, 2019·0 cites·12 claims
- 3139US8816213B2Terminal structure, printed wiring board, module substrate, and electronic deviceHORIKAWA YUHEI·Filed 2011·Granted Aug 26, 2014·0 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Yuhei Horikawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →