Inventor · disambiguated record
Yu-Liang Hsiao
Also filed as: HSIAO YU-LIANG
1 granted patent·2 pending applications·0 citations·filing 2021–2024
8Inventor score
Technology areasH10W
Files withMEDIATEK INC3
Top patents by PatentIndex Score
3 records- 0156US2024347479A1Semiconductor package having moisture passing gap in power or ground metal plane of a package substrateMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0253US2025112197A1Wirebond multichip packageMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0343US11694972B2Semiconductor package with heatsinkMEDIATEK INC·Filed 2021·Granted Jul 4, 2023·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →