Inventor · disambiguated record
Yuan-Chih Hsieh
Also filed as: HSIEH YUAN-CHIH
92 granted patents·9 pending applications·688 citations·filing 2003–2024
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD65TAIWAN SEMICONDUCTOR MFG18HSIEH YUAN-CHIH4HUANG Xin-hua2LIU PING-YIN2
Top patents by PatentIndex Score
101 records- 0199US9355882B2Transfer module for bowed wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 31, 2016·391 cites·20 claims
- 0297US11812664B2Pizoelectric MEMS device with electrodes having low surface roughnessTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·20 claims
- 0397US9725310B2Micro electromechanical system sensor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·14 cites·20 claims
- 0496US10665449B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 26, 2020·5 cites·20 claims
- 0594US12185631B2Pizoelectric MEMS device with electrodes having low surface roughnessTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 31, 2024·1 cites·20 claims
- 0694US9738516B2Structure to reduce backside silicon damageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 22, 2017·9 cites·20 claims
- 0794US7648851B2Method of fabricating backside illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jan 19, 2010·46 cites·19 claims
- 0893US8486744B2Multiple bonding in wafer level packagingLIN CHUNG-HSIEN·Filed 2010·Granted Jul 16, 2013·11 cites·20 claims
- 0993US7709872B2Methods for fabricating image sensor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted May 4, 2010·16 cites·16 claims
- 1092US11697588B2Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 11, 2023·1 cites·20 claims
- 1192US8647962B2Wafer level packaging bondLIU MARTIN·Filed 2010·Granted Feb 11, 2014·14 cites·13 claims
- 1292US7883917B2Semiconductor device with bonding padTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Feb 8, 2011·20 cites·8 claims
- 1391US9828234B2Semiconductor MEMS structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·4 cites·20 claims
- 1491US9446467B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·9 cites·19 claims
- 1591US9224615B2Noble gas bombardment to reduce scallops in bosch etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 29, 2015·12 cites·20 claims
- 1690US11050012B2Method to protect electrodes from oxidation in a MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·3 cites·20 claims
- 1790US10273142B2Semiconductor MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·20 claims
- 1890US8905293B2Self-removal anti-stiction coating for bonding processLIU PING-YIN·Filed 2010·Granted Dec 9, 2014·12 cites·19 claims
- 1990US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
- 2090US8207595B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2010·Granted Jun 26, 2012·9 cites·14 claims
- 2189US8846129B2Biological sensing structures and methods of forming the sameLIN HUNG-HUA·Filed 2012·Granted Sep 30, 2014·10 cites·20 claims
- 2287US12221337B2Semiconductor MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 2387US11198606B2Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·2 cites·20 claims
- 2487US10138118B2Structure to reduce backside silicon damageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 27, 2018·3 cites·20 claims
- 2587US9054121B2MEMS structures and methods for forming the sameLIU PING-YIN·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
- 2687US7883926B2Methods for fabricating image sensor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 8, 2011·4 cites·16 claims
- 2786US12255062B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 2886US11767216B2Semiconductor MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 26, 2023·1 cites·20 claims
- 2985US12151932B2Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 3085US8405169B2Handling layer for transparent substrateCHENG CHUN-REN·Filed 2010·Granted Mar 26, 2013·8 cites·20 claims
- 3184US11078075B2Packaging method and associated packaging structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 3, 2021·3 cites·20 claims
- 3284US8648468B2Hermetic wafer level packagingCHU RICHARD·Filed 2010·Granted Feb 11, 2014·7 cites·18 claims
- 3384US8598687B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2012·Granted Dec 3, 2013·5 cites·19 claims
- 3482US2024367965A1Conductive bond structure to increase membrane sensitivty in mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3581US8445380B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2012·Granted May 21, 2013·4 cites·20 claims
- 3681US7923344B2Method of fabricating backside illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Apr 12, 2011·4 cites·20 claims
- 3779US12139399B2Conductive bond structure to increase membrane sensitivity in MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 3879US2024368746A1Undercut-free patterned aluminum nitride structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3978US11854795B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 4078US8357561B2Method of fabricating backside illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Jan 22, 2013·1 cites·20 claims
- 4178US7799654B2Reduced refractive index and extinction coefficient layer for enhanced photosensitivityTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 21, 2010·4 cites·23 claims
- 4278US2023249961A1Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4377US8790946B2Methods of bonding caps for MEMS devicesHUANG Xin-hua·Filed 2012·Granted Jul 29, 2014·5 cites·20 claims
- 4477US2023294978A1Structure for microelectromechanical systems (mems) devices to control pressure at high temperatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4575US12134824B2Undercut-free patterned aluminum nitride structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
- 4675US11814283B2Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 4775US11521846B2Methods for patterning a silicon oxide-silicon nitride-silicon oxide stack and structures formed by the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 6, 2022·1 cites·20 claims
- 4875US7732299B2Process for wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jun 8, 2010·6 cites·20 claims
- 4975US2022340413A1Semiconductor structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 5074US11713241B2Packaging method and associated packaging structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·19 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →