Inventor · disambiguated record
Yu-Nu Hsu
Also filed as: HSU YU-NU
12 granted patents·2 pending applications·5 citations·filing 2000–2025
84Inventor score
Top patents by PatentIndex Score
14 records- 0195US12021050B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 0286US2025316630A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0384US12400987B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 0479US2024297138A1Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0575US11984419B2Package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 0674US10741513B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·20 claims
- 0769US11527504B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 0868US11469203B2Method for forming package structure with a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 0960US11469198B2Semiconductor device manufacturing method and associated semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 11, 2022·0 cites·20 claims
- 1058US10811377B2Package structure with a barrier layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 1157US10163836B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 1254US6596417B1Magnetic recording medium with a Ga3Pt5 structured underlayer and a cobalt-based magnetic layerUNIV CARNEGIE MELLON·Filed 2000·Granted Jul 22, 2003·2 cites·46 claims
- 1353US9875979B2Conductive external connector structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 23, 2018·0 cites·22 claims
- 1436US8722537B2Multi-sacrificial layer and methodHUANG YAO-TE·Filed 2010·Granted May 13, 2014·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →