Inventor · disambiguated record
Yu-Hsiang Hu
Also filed as: HU YU · HU YU-HSIANG · HU YU-HSIANG (JAMES)
207 granted patents·67 pending applications·524 citations·filing 2010–2025
99Inventor score
Top patents by PatentIndex Score
274 records- 0199US11454888B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·6 cites·20 claims
- 0299US9899248B2Method of forming semiconductor packages having through package viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·73 cites·20 claims
- 0399US9793230B1Semiconductor structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·33 cites·20 claims
- 0498US11721635B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·3 cites·20 claims
- 0598US11289396B2Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·13 cites·20 claims
- 0698US10490521B2Advanced structure for info wafer warpage reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 26, 2019·43 cites·20 claims
- 0798US9659805B2Fan-out interconnect structure and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·20 cites·20 claims
- 0897US12087654B2Sensing die encapsulated by an encapsulant with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·4 cites·20 claims
- 0997US11894336B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·3 cites·20 claims
- 1097US11854927B2Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 1197US11764124B2Sensing component encapsulated by an encapsulant with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·4 cites·20 claims
- 1297US11456280B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 1397US10658199B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 19, 2020·5 cites·20 claims
- 1497US9318429B2Integrated structure in wafer level packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·32 cites·20 claims
- 1596US12009331B2Integrated circuit packages having adhesion layers for through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·2 cites·20 claims
- 1696US11961777B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 1796US11798893B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·2 cites·20 claims
- 1896US11798857B2Composition for sacrificial film, package, manufacturing method of packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 24, 2023·4 cites·20 claims
- 1996US11791313B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 2095US11942435B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 26, 2024·2 cites·20 claims
- 2195US11322450B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 3, 2022·8 cites·20 claims
- 2295US10833053B1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·10 cites·20 claims
- 2395US10276543B1Semicondcutor device package and method of forming semicondcutor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·13 cites·20 claims
- 2494US12218009B2Semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 2594US11892774B2LithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 2694US10872864B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·10 cites·20 claims
- 2794US10304700B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 28, 2019·10 cites·24 claims
- 2894US9559064B2Warpage control in package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·11 cites·20 claims
- 2993US12165966B2Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·2 cites·20 claims
- 3093US11973023B2Stacked via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 30, 2024·2 cites·20 claims
- 3193US11114407B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 7, 2021·7 cites·20 claims
- 3293US10510645B2Planarizing RDLs in RDL-first processes through CMP processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·7 cites·20 claims
- 3392US12094728B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·1 cites·20 claims
- 3492US11868047B2Polymer layer in semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 9, 2024·2 cites·20 claims
- 3592US10510704B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·19 claims
- 3691US11948918B2Redistribution structure for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 2, 2024·2 cites·20 claims
- 3791US11664323B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 30, 2023·2 cites·20 claims
- 3891US11322360B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 3991US11201079B2Wafer chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 14, 2021·6 cites·20 claims
- 4091US10510698B2Semiconductor structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·4 cites·20 claims
- 4191US10032735B2Semiconductor structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 24, 2018·5 cites·20 claims
- 4291US2025364321A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4390US11694967B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 4, 2023·5 cites·19 claims
- 4490US11532540B2Planarizing RDLS in RDL-first processes through CMP processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·20 claims
- 4590US11171098B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·7 cites·20 claims
- 4690US11004796B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·7 cites·20 claims
- 4790US10586724B2Fan-out interconnect structure and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 10, 2020·5 cites·20 claims
- 4890US10510673B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 4990US10283461B1Info structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 7, 2019·4 cites·20 claims
- 5090US2025349643A1Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 274 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →