Inventor · disambiguated record
Yu-Chih Huang
Also filed as: HUANG YU · HUANG YU-CHIH
81 granted patents·20 pending applications·868 citations·filing 1998–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD80TAIWAN SEMICONDUCTOR MFG10IND TECH RES INST3UNIV YUAN ZE2ALCATEL LUCENT USA INC1
Top patents by PatentIndex Score
101 records- 0198US12113022B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 8, 2024·6 cites·20 claims
- 0298US9087832B2Warpage reduction and adhesion improvement of semiconductor die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·54 cites·20 claims
- 0398US6060721AApparatus for detecting correct positioning of a wafer cassetteTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted May 9, 2000·486 cites·18 claims
- 0497US11251141B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0597US9691708B1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·26 cites·20 claims
- 0695US11004786B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·10 cites·20 claims
- 0795US10832985B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·12 cites·20 claims
- 0894US11929318B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0994US11747741B2Substrate stage, substrate processing system using the same, and method for processing substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 1093US12002768B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 1193US11374136B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 1293US10747119B2Apparatus and method for monitoring reflectivity of the collector for extreme ultraviolet radiation sourceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·4 cites·20 claims
- 1393US9799620B2Warpage reduction and adhesion improvement of semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 24, 2017·9 cites·20 claims
- 1491US9871013B2Contact area design for solder bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 16, 2018·10 cites·20 claims
- 1590US12068212B2Package structure with through via extending through redistribution layer and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 1690US11742254B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 29, 2023·2 cites·20 claims
- 1790US10510631B2Fan out package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·5 cites·20 claims
- 1890US10157874B2Contact area design for solder bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·6 cites·20 claims
- 1989US10840227B2Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·5 cites·20 claims
- 2088US2024386744A1Fingerprint Sensor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2187US9904776B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 27, 2018·3 cites·20 claims
- 2286US12431446B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 2386US12362274B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 2486US11602037B1Apparatus and method for generating extreme ultraviolet radiationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·1 cites·20 claims
- 2586US10762319B2Fingerprint sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·3 cites·20 claims
- 2686US10672729B2Package structure and method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 2, 2020·3 cites·20 claims
- 2785US10878073B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·1 cites·20 claims
- 2885US10354114B2Fingerprint sensor in InFO structure and formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 16, 2019·3 cites·20 claims
- 2985US2025321507A1Method and apparatus for removing contaminationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3085US2025273565A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3184US12394242B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 3284US12111582B2Substrate stage and substrate processing system using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 3384US11204556B2Apparatus and method for monitoring reflectivity of the collector for extreme ultraviolet radiation sourceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 21, 2021·1 cites·20 claims
- 3484US10157274B2Fingerprint sensor pixel array and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·2 cites·20 claims
- 3584US2024377762A1Semiconductor substrate stage for carring substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3683US12381163B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 3783US12334434B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 3883US6423175B1Apparatus and method for reducing particle contamination in an etcherTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jul 23, 2002·70 cites·11 claims
- 3983US2024363464A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4082US12260669B2Fingerprint sensor in InFO structure and formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 4182US11482491B2Package structure with porous conductive structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 25, 2022·3 cites·10 claims
- 4282US9898645B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·2 cites·20 claims
- 4381US12399438B2Method and apparatus for removing contaminationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 4481US2025316616A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4579US2024371776A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4678US6634177B2Apparatus for the real-time monitoring and control of a wafer temperatureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 21, 2003·28 cites·14 claims
- 4777US11727714B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 4877US11309225B2Fan-out package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·1 cites·20 claims
- 4977US10268872B2Fingerprint sensor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·1 cites·20 claims
- 5077US6597964B1Thermocoupled lift pin system for etching chamberTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 22, 2003·33 cites·20 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →