Inventor · disambiguated record
Yuuki Iijima
Also filed as: IIJIMA YUUKI
6 granted patents·1 pending application·2 citations·filing 2020–2025
68Inventor score
Files withSENJU METAL INDUSTRY CO7
Top patents by PatentIndex Score
7 records- 0188US12053843B2Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit deviceSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 6, 2024·1 cites·10 claims
- 0287US11577344B2Solder alloySENJU METAL INDUSTRY CO·Filed 2021·Granted Feb 14, 2023·1 cites·4 claims
- 0373US2025276412A1Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder JointSENJU METAL INDUSTRY CO·Filed 2025·Application pending·0 cites
- 0471US12447564B2Solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Oct 21, 2025·0 cites·18 claims
- 0571US12383987B2Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Aug 12, 2025·0 cites·9 claims
- 0659US12377500B2Lead-free and antimony-free solder alloy, solder ball, and solder jointSENJU METAL INDUSTRY CO·Filed 2021·Granted Aug 5, 2025·0 cites·10 claims
- 0751US11607753B2Solder alloy, cast article, formed article, and solder jointSENJU METAL INDUSTRY CO·Filed 2020·Granted Mar 21, 2023·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →