Inventor · disambiguated record
Yuki Imazu
Also filed as: IMAZU Yuki
1 granted patent·10 pending applications·0 citations·filing 2020–2023
9Inventor score
Top patents by PatentIndex Score
11 records- 0165US2025293105A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0265US2025259859A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0361US2025287514A1Method for manufacturing electronic component deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0455US2023259026A1Photosensitive resin composition, method of producing patterned cured product using the same, and cured product of photosensitive resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 0551US2025279393A1Semiconductor device production method and structureRESONAC CORP·Filed 2023·Application pending·0 cites
- 0647US12405198B2Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 2, 2025·0 cites·14 claims
- 0747US2025293200A1Laminate manufacturing method, insulation material, and laminateRESONAC CORP·Filed 2022·Application pending·0 cites
- 0843US2024352275A1Cured resin film, semiconductor device and method for producing semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0942US2025344324A1Pattern formation method and pattern formation structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 1042US2024361697A1Method for selecting photosensitive resin composition, method for producing patterned cured film, cured film, semiconductor device, and method for producing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1141US2025105205A1Laminate manufacturing method and laminateRESONAC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →