Inventor · disambiguated record
Yuki Inaba
Also filed as: INABA YUKI
9 granted patents·3 pending applications·6 citations·filing 2013–2022
78Inventor score
Top patents by PatentIndex Score
12 records- 0177US11710709B2Terminal member made of plurality of metal layers between two heat sinksDENSO CORP·Filed 2021·Granted Jul 25, 2023·1 cites·10 claims
- 0268US9881879B2Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2017·Granted Jan 30, 2018·2 cites·18 claims
- 0363US12506045B2Semiconductor deviceDENSO CORP·Filed 2022·Granted Dec 23, 2025·0 cites·4 claims
- 0463US10396023B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Aug 27, 2019·1 cites·14 claims
- 0561US10636740B2Semiconductor device, method for manufacturing semiconductor device, and interface unitFUJI ELECTRIC CO LTD·Filed 2018·Granted Apr 28, 2020·1 cites·13 claims
- 0661US9196281B2Perpendicular magnetic recording medium having tailored granular layersFUJI ELECTRIC CO LTD·Filed 2013·Granted Nov 24, 2015·1 cites·9 claims
- 0749US11189608B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·12 claims
- 0848US9093099B2Perpendicular magnetic recording medium and method for manufacturing the sameFUJI ELECTRIC CO LTD·Filed 2013·Granted Jul 28, 2015·0 cites·6 claims
- 0947US2014072829A1Thin film structure including ordered alloy and method for manufacturing the thin film structureUNIV TOHOKU·Filed 2013·Application pending·0 cites
- 1038US2014057134A1Magnetic recording medium for thermally assisted recordingFUJI ELECTRIC CO LTD·Filed 2013·Application pending·0 cites
- 1136US10468328B2Semiconductor device and method of manufacturing a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Nov 5, 2019·0 cites·17 claims
- 1231US2017271230A1Manufacturing method of molded product and molded productFUJI ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yuki Inaba files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →