Inventor · disambiguated record
Yuusaku Ishimine
Also filed as: ISHIMINE YUUSAKU
15 granted patents·3 pending applications·3 citations·filing 2007–2022
84Inventor score
Top patents by PatentIndex Score
18 records- 0160US8366071B2Sliding member, mechanical seal ring, mechanical seal and faucet valveKYOCERA CORP·Filed 2008·Granted Feb 5, 2013·1 cites·7 claims
- 0259US10627173B2Flow path member, and heat exchanger and semiconductor manufacturing apparatus using sameKYOCERA CORP·Filed 2013·Granted Apr 21, 2020·1 cites·10 claims
- 0356US10566264B2Flow path member and semiconductor moduleKYOCERA CORP·Filed 2016·Granted Feb 18, 2020·0 cites·8 claims
- 0455US12451338B2Plasma treatment apparatus memberKYOCERA CORP·Filed 2022·Granted Oct 21, 2025·0 cites·13 claims
- 0555US10697707B2Heat exchange member and heat exchangerKYOCERA CORP·Filed 2014·Granted Jun 30, 2020·0 cites·14 claims
- 0654US12016087B2Heater and method of production of sameKYOCERA CORP·Filed 2019·Granted Jun 18, 2024·0 cites·12 claims
- 0754US10684081B2Flow path memberKYOCERA CORP·Filed 2016·Granted Jun 16, 2020·0 cites·7 claims
- 0850US9293384B2Silicon nitride substrate, circuit substrate and electronic device using the sameISHIMINE YUUSAKU·Filed 2011·Granted Mar 22, 2016·1 cites·12 claims
- 0949US2015153116A1Flow path member, and heat exchanger and semiconductor manufacturing device using sameKYOCERA CORP·Filed 2013·Application pending·0 cites
- 1047US12238827B2Base structure and wafer placing deviceKYOCERA CORP·Filed 2020·Granted Feb 25, 2025·0 cites·11 claims
- 1144US10103047B2Flow path member, heat exchanger including the flow path member, and semiconductor manufacturing apparatus including the flow path memberKYOCERA CORP·Filed 2013·Granted Oct 16, 2018·0 cites·9 claims
- 1241US11961747B2Heater and heater systemKYOCERA CORP·Filed 2019·Granted Apr 16, 2024·0 cites·12 claims
- 1341US9953898B2Flow channel member, and heat exchanger and semiconductor module each using sameKYOCERA CORP·Filed 2015·Granted Apr 24, 2018·0 cites·7 claims
- 1438US9388083B2Silicon carbide sintered body and sliding component using the same, and protective bodyIIDA MAMI·Filed 2011·Granted Jul 12, 2016·0 cites·12 claims
- 1538US2017219302A1Heat exchangerKYOCERA CORP·Filed 2015·Application pending·0 cites
- 1636US8916488B2Sliding member, manufacturing method thereof, mechanical seal ring using sliding member and mechanical seal using mechanical seal ringISHIMINE YUUSAKU·Filed 2007·Granted Dec 23, 2014·0 cites·6 claims
- 1734US2019126495A1Sample conveying memberKYOCERA CORP·Filed 2017·Application pending·0 cites
- 1833US10262917B2Flow passage member and semiconductor moduleKYOCERA CORP·Filed 2015·Granted Apr 16, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →