Inventor · disambiguated record
Yukihiro Iwanaga
Also filed as: IWANAGA YUKIHIRO
2 granted patents·4 pending applications·7 citations·filing 2013–2023
52Inventor score
Technology areasH10P
Top patents by PatentIndex Score
6 records- 0180US10008405B2Expansion method, method for manufacturing semiconductor device, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jun 26, 2018·6 cites·7 claims
- 0268US10403538B2Expansion method, method for manufacturing semiconductor device, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Sep 3, 2019·1 cites·13 claims
- 0356US2025285921A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0456US2025299994A1Method for producing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0550US2025201618A1Dicing/die-bonding film and semiconductor device manufacturing methodRESONAC CORP·Filed 2023·Application pending·0 cites
- 0629US2017213765A1Die bonding/dicing sheetHITACHI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →