Inventor · disambiguated record
Yujeong Jang
Also filed as: JANG YUJEONG
11 granted patents·5 pending applications·13 citations·filing 2020–2025
84Inventor score
Files withSTATS CHIPPAC PTE LTD16
Top patents by PatentIndex Score
16 records- 0196US11393698B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jul 19, 2022·4 cites·22 claims
- 0294US11990424B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2023·Granted May 21, 2024·2 cites·22 claims
- 0394US11862478B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jan 2, 2024·2 cites·25 claims
- 0491US11616025B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 0590US11664327B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 30, 2023·2 cites·22 claims
- 0684US11756897B2Semiconductor device and method of forming a slot in EMI shielding with improved removal depthSTATS CHIPPAC PTE LTD·Filed 2021·Granted Sep 12, 2023·1 cites·25 claims
- 0779US12266615B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 1, 2025·0 cites·23 claims
- 0875US12255152B2Semiconductor device and method of forming a slot in EMI shielding with improved removal depthSTATS CHIPPAC PTE LTD·Filed 2023·Granted Mar 18, 2025·0 cites·23 claims
- 0975US2025201729A1Selective EMI Shielding Using Preformed Mask with Fang DesignSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1072US2025273594A1Semiconductor Device and Method of Forming Multi-Layer Shielding Structure Over the Semiconductor DeviceSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1167US12444694B2Semiconductor device and method of forming selective EMI shielding with slotted substrateSTATS CHIPPAC PTE LTD·Filed 2022·Granted Oct 14, 2025·0 cites·25 claims
- 1262US12327799B2Semiconductor device and method of forming multi-layer shielding structure with layers of ferromagnetic material, protective material, laminate material or conductive material over the semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 10, 2025·0 cites·2 claims
- 1351US2023378088A1Apparatus and method for selectively forming a shielding layer on a semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1451US2023386888A1Methods for making semiconductor devicesSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1551US2023215721A1Semiconductor Manufacturing Equipment and Method of Expelling Residue Through Suction HoodSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
- 1650US12176335B2Semiconductor device and method using tape attachmentSTATS CHIPPAC PTE LTD·Filed 2022·Granted Dec 24, 2024·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →