Inventor · disambiguated record
Yun-Jung Jee
Also filed as: JEE YUN-JUNG
12 granted patents·6 pending applications·30 citations·filing 2004–2020
86Inventor score
Top patents by PatentIndex Score
18 records- 0186US7186280B2Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 6, 2007·14 cites·17 claims
- 0281US11043433B2Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 22, 2021·1 cites·26 claims
- 0381US10249544B2Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 2, 2019·2 cites·20 claims
- 0479US7428328B2Method of forming a three-dimensional image of a pattern to be inspected and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 23, 2008·7 cites·27 claims
- 0573US10593032B2Defect inspection method and defect inspection apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 17, 2020·1 cites·18 claims
- 0660US7666069B2Wafer holder and wafer conveyor equipped with the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·1 cites·12 claims
- 0757US2019214316A1Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 0851US10585115B2Scanning probe inspectorSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 10, 2020·0 cites·18 claims
- 0948US7310140B2Method and apparatus for inspecting a wafer surfaceSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 18, 2007·2 cites·21 claims
- 1048US7220173B2Wafer holder and wafer conveyor system equipped with the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 22, 2007·2 cites·13 claims
- 1145US10527556B2Optical measuring method and apparatus, and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 7, 2020·0 cites·17 claims
- 1245US2010156446A1Method of inspecting a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1343US2007188185A1Method of inspecgin a leakage current characteristic of a dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1441US7186577B2Method for monitoring a density profile of impuritiesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 6, 2007·0 cites·20 claims
- 1541US2018106731A1Semiconductor device inspection apparatus and method of driving the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1638US2007202615A1Method of measuring critical dimensionLEE BYUNG-SUG·Filed 2007·Application pending·0 cites
- 1737US10281410B2Systems and methods of testing semiconductor devices using simultaneously scanning of a plurality of regions therein and methods of forming semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 7, 2019·0 cites·17 claims
- 1836US2016261786A1Wafer Inspection Apparatus Using Three-Dimensional ImageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →