Inventor · disambiguated record
Yuji Kadowaki
Also filed as: KADOWAKI YUJI
4 granted patents·5 pending applications·2 citations·filing 2010–2025
60Inventor score
Top patents by PatentIndex Score
9 records- 0175US2025331109A1Method for manufacturing printed wiring board and laminating system used for implementing the methodIBIDEN CO LTD·Filed 2025·Application pending·0 cites
- 0273US12513828B2Method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 0364US11930601B2Method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
- 0451US2023019554A1Method for manufacturing printed wiring board and coating system for implementing the methodIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 0547US8877310B2Propylene resin multi-layer sheet, and packaging body for heat treatment using sameKANAI GEN·Filed 2011·Granted Nov 4, 2014·1 cites·12 claims
- 0646US8859062B2Multilayer propylene resin sheet and heat-treatable packaging material using sameKADOWAKI YUJI·Filed 2010·Granted Oct 14, 2014·1 cites·9 claims
- 0746US2021346241A1Resin composition, film, multilayer body, and packaging bag for medical useMCPP INNOVATION LLC·Filed 2021·Application pending·0 cites
- 0841US2019364662A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2019·Application pending·0 cites
- 0933US2013177721A1Propylene resin sheet and heat processing packaging body using sameKADOWAKI YUJI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →