Inventor · disambiguated record
Yun Sung Kang
Also filed as: KANG YUN SUNG
31 granted patents·24 pending applications·35 citations·filing 2005–2024
94Inventor score
Top patents by PatentIndex Score
55 records- 0197US11694843B2Multilayer capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Jul 4, 2023·4 cites·32 claims
- 0295US11837406B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Dec 5, 2023·4 cites·19 claims
- 0393US12027315B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2023·Granted Jul 2, 2024·1 cites·44 claims
- 0486US12354800B2Multilayer capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2024·Granted Jul 8, 2025·0 cites·26 claims
- 0586US8508105B2Inertial sensorKANG YUN SUNG·Filed 2011·Granted Aug 13, 2013·9 cites·15 claims
- 0683US10062516B2Thin-film ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 28, 2018·2 cites·12 claims
- 0782US10395842B2Thin film capacitor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 27, 2019·2 cites·16 claims
- 0880US12191081B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Jan 7, 2025·0 cites·16 claims
- 0980US9842787B2Electronic element package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 12, 2017·3 cites·12 claims
- 1076US10541668B2Acoustic resonator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 21, 2020·2 cites·17 claims
- 1175US9170270B2Inertial sensor and method for measuring acceleration using the sameHAN SEUNG HEON·Filed 2012·Granted Oct 27, 2015·3 cites·10 claims
- 1273US12424384B2Multilayer electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2023·Granted Sep 23, 2025·0 cites·48 claims
- 1373US2024222019A1Capacitor component including indium and tin, and method of manufacturing the capacitor componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1472US12482603B2Multilayer electronic component and method of manufacturing multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1570US11967462B2Capacitor component including indium and tin, and method of manufacturing the capacitor componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Apr 23, 2024·0 cites·32 claims
- 1669US12451288B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Oct 21, 2025·0 cites·30 claims
- 1767US8850888B2Inertial sensorLIM SEUNG MO·Filed 2012·Granted Oct 7, 2014·2 cites·17 claims
- 1865US12057271B2Multilayered electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 6, 2024·0 cites·22 claims
- 1962US12205768B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2023·Granted Jan 21, 2025·0 cites·22 claims
- 2061US11909380B2Acoustic resonator and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 20, 2024·0 cites·20 claims
- 2159US12148572B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Nov 19, 2024·0 cites·38 claims
- 2256US9005294B2Artificial disk for transforaminal lumbar interbody fusion (TLIF) and insertion assembly thereofYOU CHANG-HWA·Filed 2012·Granted Apr 14, 2015·3 cites·7 claims
- 2353US10141115B2Thin film capacitor including alternatively disposed dielectric layers having different thicknessesSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 27, 2018·0 cites·14 claims
- 2452US10068820B2Electronic element package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 4, 2018·0 cites·5 claims
- 2551US8701489B2Inertial sensorKIM JONG WOON·Filed 2011·Granted Apr 22, 2014·0 cites·10 claims
- 2649US10446324B2Thin film capacitorSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 15, 2019·0 cites·15 claims
- 2748US9500667B2Polling system and polling method using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 22, 2016·0 cites·10 claims
- 2847US10749098B2Electronic element package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 18, 2020·0 cites·19 claims
- 2947US2013169113A1Inertial sensor and method of manufacturing the sameLIM SEUNG MO·Filed 2012·Application pending·0 cites
- 3046US10410793B2Thin film capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 10, 2019·0 cites·30 claims
- 3146US10211808B2Acoustic wave filter device and package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 19, 2019·0 cites·24 claims
- 3245US2015135497A1Inertial sensor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3344US2013118258A1Inertial sensor and method of manufacturing the smeSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 3443US2013167633A1Inertial sensor and method of manufacturing the sameLIM SENG MO·Filed 2012·Application pending·0 cites
- 3543US2014088907A1Inertial sensor and method for correcting the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3643US2008286141A1Method for Preparing Nano-Sized Metal Powder Feedstock and Method for Producing Sintered Body Using the FeedstockUNIV SOGANG IND UNIV COOP FOUN·Filed 2005·Application pending·0 cites
- 3741US10319526B2Thin-film capacitorSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 11, 2019·0 cites·8 claims
- 3841US10298204B2Acoustic wave filter device, package to manufacture acoustic wave filter device, and method to manufacture acoustic wave filter deviceSAMSUNG ELECTRO MECH·Filed 2016·Granted May 21, 2019·0 cites·11 claims
- 3939US2015212109A1Mems sensorSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4038US2015082884A1Piezoelectric actuator module, method of manufacturing the same, and mems sensor having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4138US2011162181A1Device for polling piezoelectric element and polling method using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4238US2015143914A1Piezoelectric actuator module and mems sensor having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4338US2015188029A1Piezoelectric actuator module, method of manufacturing the same, and mems sensor having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 4436US2011181668A1Inkjet print head and manufacturing method thereofSAMSUNG ELCTRO MECHANICS CO LTD·Filed 2010·Application pending·0 cites
- 4536US2011134182A1Inkjet head packageSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4636US2011193915A1Piezoelectric actuator, inkjet head including the same, and method of manufacturing piezoelectric actuatorSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4736US2013167640A1Inertial sensor and method of manufacturing the sameLIM SEUNG MO·Filed 2012·Application pending·0 cites
- 4836US2011205313A1Inkjet print head and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 4936US2011169895A1Inkjet print head, wafer level package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 5035US2016149113A1Piezoelectric actuator and lens module including the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →