Inventor · disambiguated record
Yusuke Karasawa
Also filed as: KARASAWA YUSUKE
5 granted patents·3 citations·filing 2017–2023
65Inventor score
Top patents by PatentIndex Score
5 records- 0174US10811348B2Method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Oct 20, 2020·2 cites·19 claims
- 0272US12101894B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2023·Granted Sep 24, 2024·0 cites·21 claims
- 0363US11632862B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2021·Granted Apr 18, 2023·0 cites·17 claims
- 0454US9974162B2Interconnection substrate and method of inspecting interconnection substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted May 15, 2018·1 cites·7 claims
- 0544US12033802B2Multilayer capacitor having sintered electrode layer with wraparound portionTDK CORP·Filed 2022·Granted Jul 9, 2024·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →