Inventor · disambiguated record
Yuki Kawana
Also filed as: KAWANA YUKI
20 granted patents·10 pending applications·13 citations·filing 2016–2025
90Inventor score
Files withHITACHI CHEMICAL CO LTD10KONICA MINOLTA INC7SHOWA DENKO MATERIALS CO LTD4TOYOTA MOTOR CO LTD3WOVEN BY TOYOTA INC3
Top patents by PatentIndex Score
30 records- 0181US2025014179A1Dynamic image analysis apparatus extracting specific frames including a detection target from a dynamic image, dynamic analysis system, and storage mediumKONICA MINOLTA INC·Filed 2024·Application pending·0 cites
- 0278US10363608B2Copper paste for joining, method for producing joined body, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 30, 2019·3 cites·9 claims
- 0377US12131468B2Dynamic image analysis apparatus extracting specific frames including a detection target from a dynamic image, dynamic analysis system, and storage mediumKONICA MINOLTA INC·Filed 2023·Granted Oct 29, 2024·0 cites·7 claims
- 0476US2024383035A1Electronic component and method for manufacturing electronic componentRESONAC CORP·Filed 2024·Application pending·0 cites
- 0575US10973490B2Radiation image photographing apparatus and radiation image photographing system for radiation image photographing process and dark image acquiring processKONICA MINOLTA INC·Filed 2019·Granted Apr 13, 2021·2 cites·6 claims
- 0674US2024423568A1Dynamic analysis system, correction apparatus, storage medium, and dynamic imaging apparatusKONICA MINOLTA INC·Filed 2024·Application pending·0 cites
- 0773US11462502B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 4, 2022·2 cites·20 claims
- 0873US11370066B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 28, 2022·2 cites·20 claims
- 0970US2025293091A1Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationRESONAC CORP·Filed 2025·Application pending·0 cites
- 1069US10769760B2Image processing apparatus and imaging apparatus that performs a distortion correction processTOYOTA MOTOR CO LTD·Filed 2018·Granted Sep 8, 2020·1 cites·3 claims
- 1169US10335110B2Radiographic image capturing system and radiographic image capturing apparatusKONICA MINOLTA INC·Filed 2017·Granted Jul 2, 2019·2 cites·5 claims
- 1268US11676271B2Dynamic image analysis apparatus extracting specific frames including a detection target from a dynamic image, dynamic analysis system, and storage mediumKONICA MINOLTA INC·Filed 2020·Granted Jun 13, 2023·0 cites·16 claims
- 1366US12109059B2Dynamic analysis system, correction apparatus, storage medium, and dynamic imaging apparatusKONICA MINOLTA INC·Filed 2021·Granted Oct 8, 2024·0 cites·11 claims
- 1466US10930612B2Copper paste for pressureless bonding, bonded body and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 23, 2021·1 cites·9 claims
- 1565US11532588B2Copper paste for pressureless bonding, bonded body and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·7 claims
- 1664US2025356521A1Estimation device and estimation method for gaze directionTOYOTA MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 1758US12070800B2Electronic component and method for manufacturing electronic componentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·6 claims
- 1858US2025358399A1Projection systemTOYOTA MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 1954US2023143958A1System for neural architecture search for monocular depth estimation and method of usingWOVEN ALPHA INC·Filed 2022·Application pending·0 cites
- 2053US12354914B2Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jul 8, 2025·0 cites·13 claims
- 2151US10566304B2Assembly and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 18, 2020·0 cites·9 claims
- 2250US2024220817A1System and method for self-supervised federated learning for automotive applicationsWOVEN BY TOYOTA INC·Filed 2022·Application pending·0 cites
- 2350US2024220816A1System and method for federated learning for automotive application with knowledge distillation by teacher modelWOVEN BY TOYOTA INC·Filed 2022·Application pending·0 cites
- 2449US2024256892A1Method and system for federated learning training for a neural network associated with autonomous vehiclesWOVEN BY TOYOTA INC·Filed 2023·Application pending·0 cites
- 2544US11890681B2Method for producing bonded object and semiconductor device and copper bonding pasteSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Feb 6, 2024·0 cites·9 claims
- 2642US11483936B2Method for producing joined body, and joining materialHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·17 claims
- 2742US10748865B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 18, 2020·0 cites·17 claims
- 2839US11040416B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·8 claims
- 2938US11887960B2Member connection methodHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jan 30, 2024·0 cites·5 claims
- 3036US11575076B2Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion moduleHITACHI CHEMICAL CO LTD·Filed 2018·Granted Feb 7, 2023·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →