Inventor · disambiguated record
Yungjun Kim
Also filed as: KIM YUNGJUN
6 granted patents·4 pending applications·7 citations·filing 2017–2023
73Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0184US10388537B2Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 20, 2019·3 cites·21 claims
- 0278US10991600B2Process chamber and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 27, 2021·2 cites·20 claims
- 0377US10825698B2Substrate drying apparatus, facility of manufacturing semiconductor device, and method of drying substrateSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 3, 2020·2 cites·18 claims
- 0472US2023162970A1Cleaning liquid nozzle, cleaning apparatus, and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0567US11610788B2Process chamber and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 0663US2021098261A1Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 0762US11590628B2Rotary body module and chemical mechanical polishing apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 28, 2023·0 cites·15 claims
- 0859US12456633B2Wafer cleaning equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·20 claims
- 0956US2019348277A1Cleaning liquid nozzle, cleaning apparatus, and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 1054US2018315613A1Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yungjun Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →