Inventor · disambiguated record
Yu Kita
Also filed as: KITA YU
2 granted patents·2 pending applications·2 citations·filing 2010–2022
33Inventor score
Top patents by PatentIndex Score
4 records- 0160US9126178B2Heat-expandable microspheres and a method of making heat-expandable microspheres and application thereofKITA YU·Filed 2010·Granted Sep 8, 2015·2 cites·15 claims
- 0256US2024417526A1Thermoplastic resin composition pellet and method for producing sameMITSUBISHI CHEM CORP·Filed 2022·Application pending·0 cites
- 0355US2023250242A1Masterbatch for foam molding and application thereofMATSUMOTO YUSHI SEIYAKU KK·Filed 2021·Application pending·0 cites
- 0437US10941267B2Heat-expandable microspheres and application thereofMATSUMOTO YUSHI SEIYAKU KK·Filed 2016·Granted Mar 9, 2021·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →