Inventor · disambiguated record
Yuki Kitai
Also filed as: KITAI YUKI
25 granted patents·10 pending applications·16 citations·filing 2007–2023
91Inventor score
Files withPANASONIC IP MAN CO LTD31FUKUHARA YASUO1MITSUI CHEMICALS INC1PANASONIC ELEC WORKS CO LTD1SAGARA TAKASHI1
Top patents by PatentIndex Score
35 records- 0184US11866536B2Copper-clad laminate plate, resin-attached copper foil, and circuit board using samePANASONIC IP MAN CO LTD·Filed 2019·Granted Jan 9, 2024·2 cites·12 claims
- 0284US9567481B2Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2014·Granted Feb 14, 2017·3 cites·16 claims
- 0383US10590223B2Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2014·Granted Mar 17, 2020·3 cites·13 claims
- 0478US9708468B2Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2014·Granted Jul 18, 2017·2 cites·26 claims
- 0575US10870721B2Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·14 claims
- 0671US10240015B2Modified polyphenylene ether, method for preparing same, polyphenylene ether resin composition, resin varnish, prepreg, metal-clad laminate and printed circuit boardPANASONIC IP MAN CO LTD·Filed 2013·Granted Mar 26, 2019·3 cites·15 claims
- 0769US8409704B2Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring boardFUKUHARA YASUO·Filed 2007·Granted Apr 2, 2013·3 cites·10 claims
- 0865US2025109233A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 0964US11242425B2Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring platePANASONIC IP MAN CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·25 claims
- 1063US2010218982A1Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring boardPANASONIC ELEC WORKS CO LTD·Filed 2008·Application pending·0 cites
- 1162US11958951B2Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 16, 2024·0 cites·19 claims
- 1262US2025215125A1Cyclic olefin-based resin composition, varnish, crosslinked body, film, sheet, circuit board, electronic apparatus, and prepregMITSUI CHEMICALS INC·Filed 2023·Application pending·0 cites
- 1362US2023272213A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1460US2023257578A1Resin composition, prepreg, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1559US2015359093A1Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 1658US11770904B2Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using samePANASONIC IP MAN CO LTD·Filed 2019·Granted Sep 26, 2023·0 cites·5 claims
- 1757US12022611B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Jun 25, 2024·0 cites·10 claims
- 1857US11401393B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Aug 2, 2022·0 cites·7 claims
- 1956US12428534B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Sep 30, 2025·0 cites·17 claims
- 2056US12024590B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2019·Granted Jul 2, 2024·0 cites·17 claims
- 2156US2022389189A1Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 2255US12312452B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted May 27, 2025·0 cites·24 claims
- 2355US2023212392A1Resin composition for wiring board material, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board in which said resin composition is usedPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 2454US12109779B2Copper-clad laminate, wiring board, and copper foil with resinPANASONIC IP MAN CO LTD·Filed 2020·Granted Oct 8, 2024·0 cites·12 claims
- 2554US9637598B2Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is usedPANASONIC IP MAN CO LTD·Filed 2014·Granted May 2, 2017·0 cites·7 claims
- 2653US11820105B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Nov 21, 2023·0 cites·6 claims
- 2753US11351755B2Metal-clad laminate, printed wiring board and metal foil with resinPANASONIC IP MAN CO LTD·Filed 2017·Granted Jun 7, 2022·0 cites·8 claims
- 2852US10820413B2Metal-clad laminate, metal member with resin, and wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 27, 2020·0 cites·8 claims
- 2952US10047213B2Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is usedPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 14, 2018·0 cites·12 claims
- 3051US12233621B2Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foilPANASONIC IP MAN CO LTD·Filed 2020·Granted Feb 25, 2025·0 cites·12 claims
- 3144US10897818B2Metal-clad laminate, method for producing same, metal foil with resin, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 19, 2021·0 cites·28 claims
- 3243US9528026B2Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring boardSAGARA TAKASHI·Filed 2012·Granted Dec 27, 2016·0 cites·21 claims
- 3343US2022289969A1Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 3442US2017029619A1Thermosetting resin composition, and resin varnish, metal foil with resin, resin film, metal-clad laminate, and printed wiring board using the samePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 3539US11254100B2Metal-clad laminate and metal foil with resinPANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 22, 2022·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →