Inventor · disambiguated record
Yumie Kitajima
Also filed as: KITAJIMA Yumie
2 granted patents·1 pending application·1 citations·filing 2014–2018
32Inventor score
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0161US10522482B2Semiconductor device manufacturing method comprising bonding an electrode terminal to a conductive pattern on an insulating substrate using ultrasonic bondingMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 31, 2019·1 cites·1 claims
- 0242US2017207179A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Application pending·0 cites
- 0330US10672739B2Power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 2, 2020·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →