Inventor · disambiguated record
Yugo Koyama
Also filed as: KOYAMA YUGO
14 granted patents·4 pending applications·212 citations·filing 1999–2014
93Inventor score
Top patents by PatentIndex Score
18 records- 0190US7057331B2Piezoelectric oscillator, portable telephone unit using piezoelectric oscillator, and electronic equipment using piezoelectric oscillatorSEIKO EPSON CORP·Filed 2004·Granted Jun 6, 2006·37 cites·7 claims
- 0283US6917142B2Piezoelectric oscillator, portable telephone using a piezoelectric oscillator, and electronic device using a piezoelectric oscillatorSEIKO EPSON CORP·Filed 2003·Granted Jul 12, 2005·37 cites·17 claims
- 0381US7576476B2Piezoelectric device and method for manufacturing the sameEPSON TOYOCOM CORP·Filed 2007·Granted Aug 18, 2009·10 cites·4 claims
- 0481US6998926B2Piezoelectric oscillator, portable phone employing piezoelectric oscillator, and electronic apparatus employing piezoelectric oscillatorSEIKO EPSON CORP·Filed 2003·Granted Feb 14, 2006·36 cites·11 claims
- 0574US7123107B2Piezoelectric oscillator, manufacturing method thereof, and electronic deviceSEIKO EPSON CORP·Filed 2003·Granted Oct 17, 2006·19 cites·24 claims
- 0673US7218036B2Piezoelectric oscillator, manufacturing method therefor, mobile phone apparatus using piezoelectric oscillator, and electronic apparatus using piezoelectric oscillatorSEIKO EPSON CORP·Filed 2004·Granted May 15, 2007·21 cites·8 claims
- 0769US7408291B2Piezoelectric oscillator, manufacturing method thereof, and electronic deviceSEIKO EPSON CORP·Filed 2006·Granted Aug 5, 2008·4 cites·3 claims
- 0867USD532758SOscillatorSEIKO EPSON CORP·Filed 2004·Granted Nov 28, 2006·15 cites·1 claims
- 0962US7545083B2Piezoelectric device and method for manufacturing the sameEPSON TOYOCOM CORP·Filed 2007·Granted Jun 9, 2009·3 cites·4 claims
- 1060US8841762B2Sensor module, sensor device, manufacturing method of sensor device, and electronic apparatusKOYAMA YUGO·Filed 2012·Granted Sep 23, 2014·2 cites·21 claims
- 1159USD562273SOscillatorEPSON TOYOCOM CORP·Filed 2006·Granted Feb 19, 2008·11 cites·1 claims
- 1251US6689679B2Semiconductor device having bumpsSEIKO EPSON CORP·Filed 2001·Granted Feb 10, 2004·4 cites·12 claims
- 1351US6437453B1Wire bonding method, semiconductor device, circuit board, electronic instrument and wire bonding deviceSEIKO EPSON CORP·Filed 2000·Granted Aug 20, 2002·4 cites·26 claims
- 1444US6323552B1Semiconductor device having bumpsSEIKO EPSON CORP·Filed 1999·Granted Nov 27, 2001·9 cites·15 claims
- 1544US2014345928A1Electronic part, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 1638US2007138916A1Piezoelectric deviceEPSON TOYOCOM CORP·Filed 2006·Application pending·0 cites
- 1737US2007024161A1Piezoelectric device and method of manufacturing piezoelectric deviceSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 1834US2012236507A1Sensor module, sensor device, method for producing sensor device, and electronic apparatusKOYAMA YUGO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →