Inventor · disambiguated record
Yusuke Kubo
Also filed as: KUBO YUSUKE
19 granted patents·16 pending applications·8 citations·filing 2010–2025
88Inventor score
Top patents by PatentIndex Score
35 records- 0187US10892204B2Electromagnetic wave absorbing heat conductive sheet, method for producing electromagnetic wave absorbing heat conductive sheet, and semiconductor deviceDEXERIALS CORP·Filed 2017·Granted Jan 12, 2021·6 cites·15 claims
- 0285US2025359301A1Semiconductor deviceROHM CO LTD·Filed 2025·Application pending·0 cites
- 0376US12402399B2Semiconductor deviceROHM CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·17 claims
- 0467US12472592B2Heat transfer sheet, method for producing heat transfer sheet, heat transfer sheet package, and method for producing heat transfer sheet packageSEKISUI CHEMICAL CO LTD·Filed 2025·Granted Nov 18, 2025·0 cites·10 claims
- 0566US8465663B2Composition for electromagnetic wave suppression and heat radiation and method for manufacturing composition for electromagnetic wave suppression and heat radiationKATO YOSHIHIRO·Filed 2010·Granted Jun 18, 2013·2 cites·21 claims
- 0664US12233493B2Heat transfer sheet, method for producing heat transfer sheet, heat transfer sheet package, and method for producing heat transfer sheet packageDEXERIALS CORP·Filed 2022·Granted Feb 25, 2025·0 cites·4 claims
- 0762US2024117148A1Thermally conductive sheet, thermally conductive sheet supply form, thermally conductive sheet precursor, and method for manufacturing thermally conductive sheetDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 0860US11664369B2Semiconductor deviceROHM CO LTD·Filed 2019·Granted May 30, 2023·0 cites·19 claims
- 0960US2024076223A1Apparatus for producing glass base material, and method for producing glass base materialSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Application pending·0 cites
- 1055US2022051189A1Automatic negotiation apparatus, automatic negotiation method, and computer-readable recording mediumNEC CORP·Filed 2019·Application pending·0 cites
- 1153US11597196B2Method for producing thermally conductive sheetDEXERIALS CORP·Filed 2020·Granted Mar 7, 2023·0 cites·9 claims
- 1253US2023246103A1Semiconductor deviceROHM CO LTD·Filed 2022·Application pending·0 cites
- 1352US10002704B2Coil moduleDEXERIALS CORP·Filed 2013·Granted Jun 19, 2018·0 cites·11 claims
- 1448US11929303B2Semiconductor device and method of producing the sameDEXERIALS CORP·Filed 2019·Granted Mar 12, 2024·0 cites·11 claims
- 1548US11742258B2Thermally conductive sheet and method for manufacturing thermally conductive sheetDEXERIALS CORP·Filed 2021·Granted Aug 29, 2023·0 cites·9 claims
- 1648US11329005B2Semiconductor device and method of producing the sameDEXERIALS CORP·Filed 2019·Granted May 10, 2022·0 cites·11 claims
- 1748US2024262979A1Thermally-conductive sheet and thermally-conductive sheet production methodDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1848US2022089919A1Thermally conductive sheet and method for producing thermally conductive sheetDEXERIALS CORP·Filed 2020·Application pending·0 cites
- 1948US2024120254A1Thermally-conductive sheet and electronic deviceDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 2047US10720525B2Semiconductor deviceROHM CO LTD·Filed 2019·Granted Jul 21, 2020·0 cites·12 claims
- 2147US2023155020A1Semiconductor deviceROHM CO LTD·Filed 2021·Application pending·0 cites
- 2246US2023348679A1Thermally conductive sheet and production method for thermally conductive sheetDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 2346US2024010898A1Thermally conductive sheet and method for manufacturing thermally conductive sheetDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 2445US11315889B2Electronic deviceDEXERIALS CORP·Filed 2019·Granted Apr 26, 2022·0 cites·16 claims
- 2545US11264451B2Semiconductor device exhibiting soft recovery characteristicsROHM CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·14 claims
- 2644US10847616B2Semiconductor device, method of manufacturing semiconductor device, and semiconductor packageROHM CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·13 claims
- 2744US2022240411A1Thermal conductive sheet and method for producing the same, and heat dissipation structure and electronic deviceDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 2844US2022173494A1Antenna array for 5g communications, antenna structure, noise-suppressing thermally conductive sheet, and thermally conductive sheetDEXERIALS CORP·Filed 2020·Application pending·0 cites
- 2943US2016104937A1Coil module, antenna device, and electronic deviceDEXERIALS CORP·Filed 2014·Application pending·0 cites
- 3042US11127850B2Semiconductor deviceROHM CO LTD·Filed 2018·Granted Sep 21, 2021·0 cites·12 claims
- 3140US10103228B2Semiconductor device having a super junction structureROHM CO LTD·Filed 2017·Granted Oct 16, 2018·0 cites·12 claims
- 3240US9685505B2Semiconductor device with guard ringsROHM CO LTD·Filed 2015·Granted Jun 20, 2017·0 cites·17 claims
- 3337US9887279B2Semiconductor device and inverter including the semiconductor deviceROHM CO LTD·Filed 2016·Granted Feb 6, 2018·0 cites·14 claims
- 3435US2015222018A1Antenna device and electronic apparatusDEXERIALS CORP·Filed 2015·Application pending·0 cites
- 3535US2015222017A1Antenna device, non-contact power transmission antenna unit, and electronic apparatusDEXERIALS CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yusuke Kubo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →