Inventor · disambiguated record
Yui Kunito
Also filed as: KUNITO Yui
1 granted patent·2 pending applications·0 citations·filing 2019–2023
6Inventor score
Files withRESONAC CORP3
Top patents by PatentIndex Score
3 records- 0140US11634614B2Method for manufacturing semiconductor device, heat-curable resin composition, and dicing-die attach filmRESONAC CORP·Filed 2019·Granted Apr 25, 2023·0 cites·16 claims
- 0237US2025197687A1Adhesive film for semiconductors, dicing die bonding film, and method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0336US2025210572A1Adhesive film for semiconductors, integrated dicing/die bonding film and method for producing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →