Inventor · disambiguated record
Yu-Pi Kuo
Also filed as: KUO YU-PI
4 granted patents·7 pending applications·1 citations·filing 2015–2024
55Inventor score
Files withASPHETEK SOLUTION CHENGDU LTD7RECO TECH CHENGDU CO LTD2GENERAL INTERFACE SOLUTION LTD1INTERFACE OPTOELECTRONIC (SHENZHEN) CO LTD1
Top patents by PatentIndex Score
11 records- 0157US2025319559A1Fixing mechanism and fixing device having the sameASPHETEK SOLUTION CHENGDU LTD·Filed 2024·Application pending·0 cites
- 0257US2025360599A1Limiting mechanism with improved space efficiencyASPHETEK SOLUTION CHENGDU LTD·Filed 2024·Application pending·0 cites
- 0356US10788912B2Touch display module and electronic device using sameRECO TECH CHENGDU CO LTD·Filed 2018·Granted Sep 29, 2020·1 cites·16 claims
- 0456US2025334807A1Dual-face photosensitive lens assembly and wearable smart device using the sameASPHETEK SOLUTION CHENGDU LTD·Filed 2024·Application pending·0 cites
- 0554US12422686B2Smart glasses and wearable systemASPHETEK SOLUTION CHENGDU LTD·Filed 2024·Granted Sep 23, 2025·0 cites·16 claims
- 0654US2025060555A1Lens assembly and processing method of lens assemblyASPHETEK SOLUTION CHENGDU LTD·Filed 2024·Application pending·0 cites
- 0753US2025049318A1Intraocular pressure detection device and glasses with intraocular pressure detection functionASPHETEK SOLUTION CHENGDU LTD·Filed 2023·Application pending·0 cites
- 0853US2025303617A1Mould assembly, optical component and using method of mould assemblyASPHETEK SOLUTION CHENGDU LTD·Filed 2024·Application pending·0 cites
- 0947US10803278B2Panel structureRECO TECH CHENGDU CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·10 claims
- 1030US9898643B2Fingerprint identification device and manufacturing method thereofINTERFACE OPTOELECTRONIC SHENZHEN CO LTD·Filed 2015·Granted Feb 20, 2018·0 cites·9 claims
- 1128US2017062102A1Method for manufacturing blind hole of insulating substrate for electronic deviceGENERAL INTERFACE SOLUTION LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →