Inventor · disambiguated record
Yuuichi Kurashima
Also filed as: KURASHIMA Yuuichi
5 granted patents·4 pending applications·9 citations·filing 2013–2022
68Inventor score
Files withAIST4MITSUBISHI HEAVY IND MACHINE TOOL CO LTD2NAT INST ADVANCED IND SCIENCE & TECH1NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCINCE AND TECH1TOYOTA JIDOSHOKKI KK1
Top patents by PatentIndex Score
9 records- 0190US9751754B2Package formation method and MEMS packageNAT INST ADVANCED IND SCIENCE & TECH·Filed 2015·Granted Sep 5, 2017·7 cites·12 claims
- 0268US9761479B2Manufacturing method for semiconductor substrateTOYOTA JIDOSHOKKI KK·Filed 2014·Granted Sep 12, 2017·2 cites·16 claims
- 0350US12027440B2Composite having diamond crystal baseAIST·Filed 2020·Granted Jul 2, 2024·0 cites·9 claims
- 0448US2024258195A1Bonded body comprising mosaic diamond wafer and semiconductor of different type, method for producing same, and mosaic diamond wafer for use in bonded body with semiconductor of different typeAIST·Filed 2022·Application pending·0 cites
- 0546US2024149565A1Composite body comprising silicon carbide and method for producing sameAIST·Filed 2022·Application pending·0 cites
- 0644US12389520B2Plasma source, and atomic clock employing plasma sourceAIST·Filed 2022·Granted Aug 12, 2025·0 cites·16 claims
- 0743US9580306B2Room temperature bonding apparatus and room temperature bonding methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·16 claims
- 0841US2023170276A1Diamond composite and method of manufacturing the sameNATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCINCE AND TECH·Filed 2021·Application pending·0 cites
- 0936US2019172813A1Substrate joining methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →