Inventor · disambiguated record
Yu-Chang Lai
Also filed as: LAI YU-CHANG
1 granted patent·2 pending applications·2 citations·filing 2010–2023
19Inventor score
Top patents by PatentIndex Score
3 records- 0157US2022388092A1Methods for forming bonding structuresUNIV NAT TAIWAN·Filed 2022·Application pending·0 cites
- 0252US8633857B2Antenna structureWANG YANG-KAI·Filed 2010·Granted Jan 21, 2014·2 cites·9 claims
- 0348US2024395750A1Three-Dimensional Integrated Circuit with Hybrid Bond Metal StructureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →