Inventor · disambiguated record

Yu-Chia Lai

Also filed as: LAI YU-CHIA

79 granted patents·27 pending applications·200 citations·filing 2009–2025

99Inventor score

Technology areasH10W H05K G06F H10P G11B

Files withTAIWAN SEMICONDUCTOR MFG CO LTD97 LAI YU-CHIA3 HON HAI PREC IND CO LTD2 TAIWAN SEMICONDUCTOR MFG2 CHANG YAO-TING1

Top patents by PatentIndex Score

106 records

0198US11848300B2Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·4 cites·20 claims
0298US11502013B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·4 cites·20 claims
0397US11798925B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·3 cites·20 claims
0497US11424213B2Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
0596US11848319B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
0696US9640498B1Integrated fan-out (InFO) package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·20 cites·20 claims
0796US9627332B1Integrated circuit structure and seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·22 cites·20 claims
0895US12368141B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·19 claims
0993US9153504B2Metal insulator metal capacitor and method for making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·13 cites·20 claims
1092US12057405B2Packages with thick RDLs and thin RDLs stacked alternatinglyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·1 cites·20 claims
1192US11646255B2Chip package structure including a silicon substrate interposer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·2 cites·20 claims
1292US11495590B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
1392US11183487B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·9 cites·20 claims
1492US11121052B2Integrated fan-out device, 3D-IC system, and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·8 cites·20 claims
1592US10847505B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·6 cites·20 claims
1690US11508665B2Packages with thick RDLs and thin RDLs stacked alternatinglyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·2 cites·20 claims
1790US11444002B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
1890US11088125B2IPD modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·19 claims
1990US8422227B2Electronic device and heat dissipation device thereofLAI YU-CHIA·Filed 2011·Granted Apr 16, 2013·12 cites·4 claims
2090US8405987B2Cooling system for electronic device and electronic device having sameLAI YU-CHIA·Filed 2011·Granted Mar 26, 2013·12 cites·10 claims
2188US11062975B2Package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 13, 2021·4 cites·20 claims
2287US8363401B2Air guiding device and heat dissipation system having sameHON HAI PREC IND CO LTD·Filed 2011·Granted Jan 29, 2013·9 cites·10 claims
2385US10985101B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·4 cites·19 claims
2485US9947630B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
2585US9048149B2Self-alignment structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·6 cites·20 claims
2685US2025349793A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2785US2025096198A1Semiconductor device, circuit board structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2884US12500200B2Package structure with conductive patterns in a redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
2984US2024405005A1Ipd modules with flexible connection scheme in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3083US12278208B2Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
3183US2025096203A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3282US12278199B2Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
3382US11282791B2Semiconductor device having a heat dissipation structure connected chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
3482US11004758B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
3582US10354986B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·2 cites·20 claims
3682US9559044B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·20 claims
3782US2025323182A1Semiconductor packages and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3881US11004827B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 11, 2021·2 cites·20 claims
3981US10985121B2Bump structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·2 cites·20 claims
4081US9786618B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
4181US9461106B1MIM capacitor and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·4 cites·20 claims
4281US2025219010A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4380US12205923B2Semiconductor device, circuit board structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
4479US2024355754A1Packages with thick rdls and thin rdls stacked alternatinglyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4579US2025357242A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4678US12166015B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
4778US11990381B2Integrated circuit packages having support ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
4878US9852985B1Conductive terminal on integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·3 cites·20 claims
4978US9799615B1Package structures having height-adjusted molding members and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·3 cites·19 claims
5078US2025239528A1Semiconductor device having a heat dissipation structure connected chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites

Showing the top 50 of 106 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →