Inventor · disambiguated record
Yung Piu Lau
Also filed as: LAU YUNG PIU
2 granted patents·20 citations·filing 2002–2003
60Inventor score
Technology areasH10P
Top patents by PatentIndex Score
2 records- 0162US6667073B1Leadframe for enhanced downbond registration during automatic wire bond processQUALITY PLATERS LTD·Filed 2002·Granted Dec 23, 2003·14 cites·9 claims
- 0251US6822319B1Leadframe for enhanced downbond registration during automatic wire bond processQPL LTD·Filed 2003·Granted Nov 23, 2004·6 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →