Inventor · disambiguated record
Yu-Ying Lee
Also filed as: LEE YU-YING
24 granted patents·1 pending application·24 citations·filing 2011–2025
92Inventor score
Top patents by PatentIndex Score
25 records- 0189US10446411B2Semiconductor device package with a conductive postADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 15, 2019·5 cites·18 claims
- 0286US10049893B2Semiconductor device with a conductive postADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 14, 2018·4 cites·23 claims
- 0384US2025285950A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0482US11469165B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 11, 2022·1 cites·18 claims
- 0580US11211536B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 28, 2021·1 cites·2 claims
- 0680US10741482B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 11, 2020·2 cites·16 claims
- 0778US12315785B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 27, 2025·0 cites·16 claims
- 0877US10224298B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 5, 2019·2 cites·19 claims
- 0973US11784296B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 10, 2023·0 cites·16 claims
- 1073US9984989B2Semiconductor substrate and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted May 29, 2018·2 cites·13 claims
- 1171US10515884B2Substrate having a conductive structure within photo-sensitive resinADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 24, 2019·2 cites·25 claims
- 1268US10483196B2Embedded trace substrate structure and semiconductor package structure including the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Nov 19, 2019·1 cites·18 claims
- 1365US8779581B2Heat dissipating semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Granted Jul 15, 2014·2 cites·12 claims
- 1464US9911702B2Semiconductor package structure and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Mar 6, 2018·1 cites·24 claims
- 1562US10665765B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted May 26, 2020·0 cites·26 claims
- 1661US12033934B2Package structure, optical structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 1761US9054118B2Heat dissipating semiconductor device packages and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jun 9, 2015·1 cites·20 claims
- 1857US11862550B2Electronic package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 2, 2024·0 cites·12 claims
- 1957US11569179B2Package structure including an outer lead portion and an inner lead portion and method for manufacturing package structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 31, 2023·0 cites·18 claims
- 2057US10734337B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 4, 2020·0 cites·16 claims
- 2154US10103110B2Semiconductor package structure and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 16, 2018·0 cites·25 claims
- 2243US10049976B2Semiconductor substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 2340US8592962B2Semiconductor device packages with protective layer and related methodsCHEN KUANG-HSIUNG·Filed 2011·Granted Nov 26, 2013·0 cites·17 claims
- 2437US10879159B2Substrate, semiconductor package thereof and process of making sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 29, 2020·0 cites·18 claims
- 2537US10002843B2Semiconductor substrate structure, semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 19, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →