Inventor · disambiguated record
Yuehying Lee
Also filed as: LEE YUEHYING
10 granted patents·4 pending applications·4 citations·filing 2021–2025
81Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14
Top patents by PatentIndex Score
14 records- 0194US11940659B2Optical integrated circuit structure including edge coupling protective features and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·2 cites·20 claims
- 0293US11892678B2Photonic device and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 0383US12353034B2Optical integrated circuit structure including edge coupling protective features and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0482US2025306309A1Optical integrated circuit structure including edge coupling protective features and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0581US2025110283A1Optical coupling systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0681US2025085476A1Photonic device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0780US12169308B2Method of using fiber to chip coupler and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0879US12153255B2Method of making photonic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 0979US12050348B2Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1078US2024361532A1Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1174US11848390B2Capping structures for germanium-containing photovoltaic components and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1272US12072534B2Fiber to chip coupler and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 1372US11892681B2Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 1466US11532759B2Capping structures for germanium-containing photovoltaic components and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Yuehying Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →