Inventor · disambiguated record
Yuyong Lee
Also filed as: LEE YUYONG
3 granted patents·1 pending application·78 citations·filing 2009–2010
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0189US8030750B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Oct 4, 2011·44 cites·19 claims
- 0288US8368185B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Feb 5, 2013·26 cites·20 claims
- 0375US8178961B2Semiconductor package structure and package processHAN INGYU·Filed 2010·Granted May 15, 2012·8 cites·14 claims
- 0433US2011163430A1Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods ThereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →