Inventor · disambiguated record
Yun Lee
Also filed as: LEE YUN · LEE YUN IM
8 granted patents·3 pending applications·29 citations·filing 2013–2025
83Inventor score
Top patents by PatentIndex Score
11 records- 0197US11362003B2Prevention of contact bottom void in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·4 cites·20 claims
- 0297US10177038B1Prevention of contact bottom void in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 8, 2019·17 cites·20 claims
- 0394US10825737B2Prevention of contact bottom void in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·7 cites·20 claims
- 0492US2025357210A1Methods For Reducing Contact Depth Variation In Semiconductor FabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0586US2024363429A1Prevention of contact bottom void in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0681US12438049B2Methods for reducing contact depth variation in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 0778US12062578B2Prevention of contact bottom void in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 0877US10685880B2Methods for reducing contact depth variation in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 16, 2020·1 cites·20 claims
- 0968US11495494B2Methods for reducing contact depth variation in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 8, 2022·0 cites·16 claims
- 1064US11062945B2Methods for reducing contact depth variation in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 13, 2021·0 cites·15 claims
- 1139US2013319731A1Printed circuit board of semiconductor package for decreasing noise by electromagnetic interferenceSTS SC & TELECOMM CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →