Inventor · disambiguated record
Yuntae Lee
Also filed as: LEE YUNTAE
2 granted patents·1 pending application·1 citations·filing 2019–2023
29Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0164US11469148B2Semiconductor package having a redistribution layer for package-on-package structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 11, 2022·1 cites·18 claims
- 0261US2024193323A1Method of semiconductor process simulationSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0345US11205631B2Semiconductor package including multiple semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →