Inventor · disambiguated record
Yung-Ta Li
Also filed as: LI YUNG-TA
12 granted patents·4 pending applications·64 citations·filing 2011–2024
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7SILICONWARE PRECISION INDUSTRIES CO LTD5TAIWAN SEMICONDUCTOR MFG3KELLY ANDREW JOSEPH1
Top patents by PatentIndex Score
16 records- 0196US9543419B1FinFET structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 10, 2017·25 cites·20 claims
- 0295US8987791B2FinFETs and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 24, 2015·18 cites·19 claims
- 0393US9620633B2Quantum well fin-like field effect transistor (QWFinFET) having a two-section combo QW structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·10 cites·20 claims
- 0486US11164755B1Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Nov 2, 2021·2 cites·13 claims
- 0582US8901665B2Gate structure for semiconductor deviceKELLY ANDREW JOSEPH·Filed 2011·Granted Dec 2, 2014·7 cites·16 claims
- 0670US9263586B2Quantum well fin-like field effect transistor (QWFinFET) having a two-section combo QW structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·2 cites·20 claims
- 0760US2025372495A1Electronic package and manufacturing method thereof and interposerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0858US2025046662A1Packaging structure, electronic package, and methods for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 0956US9887274B2FinFETs and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 6, 2018·0 cites·20 claims
- 1056US9437699B2Method of forming nanowiresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 6, 2016·0 cites·15 claims
- 1156US2023411364A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1255US9349841B2FinFETs and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 24, 2016·0 cites·20 claims
- 1354US2024162101A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1452US10923566B2Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 16, 2021·0 cites·19 claims
- 1552US10354998B2Structures and methods for fabricating semiconductor devices using fin structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·0 cites·20 claims
- 1651US9871037B2Structures and methods for fabricating semiconductor devices using fin structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 16, 2018·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Yung-Ta Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →