Inventor · disambiguated record
Yuan Li
Also filed as: LI YUAN · LI YUAN-CHUN · LI YUAN-CHUN FRANCIS
8 granted patents·5 pending applications·34 citations·filing 2006–2023
77Inventor score
Files withDELL PRODUCTS LP2NATIONAL UNIV OF DEFENSE TECHNOLOGY2Nexperia BV2QUALCOMM INC2SILICONWARE PRECISION INDUSTRIES CO LTD2
Top patents by PatentIndex Score
13 records- 0193US7679172B2Semiconductor package without chip carrier and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Mar 16, 2010·33 cites·27 claims
- 0269US11558315B2Converged network interface card, message coding method and message transmission method thereofNATIONAL UNIV OF DEFENSE TECHNOLOGY·Filed 2020·Granted Jan 17, 2023·1 cites·9 claims
- 0357US11437307B2Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second directionQUALCOMM INC·Filed 2020·Granted Sep 6, 2022·0 cites·14 claims
- 0452US10916494B2Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second directionQUALCOMM INC·Filed 2019·Granted Feb 9, 2021·0 cites·12 claims
- 0552US2009241050A1System for enterprise service flowsKUO JYH-HUEI·Filed 2008·Application pending·0 cites
- 0652US2009119140A1Process-controlled enterprise resource planning system (PERP)TOPCO SCIENT CO LTD·Filed 2008·Application pending·0 cites
- 0751US2024231869A9Cluster management plugin with support for multiple clusters and cluster managersDELL PRODUCTS LP·Filed 2022·Application pending·0 cites
- 0850US12463055B2Package substrate manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·10 claims
- 0947US12476220B2Substrate-based package semiconductor device with side wettable flanksNexperia BV·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims
- 1047US2023223325A1Semiconductor package substrate made from non-metallic material and a method of manufacturing thereofNexperia BV·Filed 2023·Application pending·0 cites
- 1145US11929876B1Method for modifying network configuration of resource manager and managed resourcesDELL PRODUCTS LP·Filed 2022·Granted Mar 12, 2024·0 cites·9 claims
- 1244US2008308951A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1343US12278735B2Isolation method for high-performance computer system, and high-performance computer systemNATIONAL UNIV OF DEFENSE TECHNOLOGY·Filed 2023·Granted Apr 15, 2025·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →