Inventor · disambiguated record
Yuan Li
Also filed as: LI YUAN · LI YUAN JOHN
18 granted patents·1 pending application·287 citations·filing 2000–2024
93Inventor score
Top patents by PatentIndex Score
19 records- 0196US10548240B1Cooling electronic devices in a data centerGOOGLE LLC·Filed 2019·Granted Jan 28, 2020·24 cites·20 claims
- 0294US11832396B2Cooling electronic devices in a data centerGOOGLE LLC·Filed 2020·Granted Nov 28, 2023·3 cites·22 claims
- 0394US11600548B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2021·Granted Mar 7, 2023·4 cites·20 claims
- 0494US10548239B1Cooling electronic devices in a data centerGOOGLE LLC·Filed 2018·Granted Jan 28, 2020·12 cites·22 claims
- 0593US10019506B1Identifying objects in imagesGOOGLE LLC·Filed 2015·Granted Jul 10, 2018·25 cites·20 claims
- 0690US10681846B2Cooling electronic devices in a data centerGOOGLE LLC·Filed 2018·Granted Jun 9, 2020·5 cites·28 claims
- 0790US10083920B1Package stiffener for protecting semiconductor dieGOOGLE LLC·Filed 2018·Granted Sep 25, 2018·6 cites·20 claims
- 0889US10268703B1System and method for associating images with semantic entitiesGOOGLE LLC·Filed 2016·Granted Apr 23, 2019·6 cites·20 claims
- 0989US6477518B1Method of knowledge-based engineering cost and weight estimation of an HVAC air-handling assembly for a climate control systemVISTEON GLOBAL TECH INC·Filed 2000·Granted Nov 5, 2002·195 cites·16 claims
- 1085US11488890B2Direct liquid cooling with O-ring sealingGOOGLE LLC·Filed 2020·Granted Nov 1, 2022·2 cites·21 claims
- 1184US11990386B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2021·Granted May 21, 2024·1 cites·18 claims
- 1283US12243802B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2024·Granted Mar 4, 2025·0 cites·7 claims
- 1380US10964625B2Device and method for direct liquid cooling via metal channelsGOOGLE LLC·Filed 2019·Granted Mar 30, 2021·3 cites·31 claims
- 1476US12278160B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2023·Granted Apr 15, 2025·0 cites·15 claims
- 1571US12272619B2Direct liquid cooling with O-ring sealingGOOGLE LLC·Filed 2022·Granted Apr 8, 2025·0 cites·16 claims
- 1670US10468359B2Package stiffener for protecting semiconductor dieGOOGLE LLC·Filed 2018·Granted Nov 5, 2019·1 cites·18 claims
- 1761US11721641B2Weight optimized stiffener and sealing structure for direct liquid cooled modulesGOOGLE LLC·Filed 2020·Granted Aug 8, 2023·0 cites·18 claims
- 1847US2025111674A1Summarizing Events Over a Time PeriodGOOGLE LLC·Filed 2024·Application pending·0 cites
- 1946US12315782B2Spring loaded compliant coolant distribution manifold for direct liquid cooled modulesGOOGLE LLC·Filed 2020·Granted May 27, 2025·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →