Inventor · disambiguated record
Yuan-Kai Liang
Also filed as: LIANG YUAN · LIANG YUAN-KAI
1 granted patent·1 pending application·1 citations·filing 2015–2022
17Inventor score
Top patents by PatentIndex Score
2 records- 0162US2024284989A1Heat-not-burn capsule, material and preparation of heat-not-burn capsule, dipping mold, and production deviceALTRIA CLIENT SERVICES LLC·Filed 2022·Application pending·0 cites
- 0254US9421644B2Soldering structure and process of making the sameUNIV CHUNG YUAN CHRISTIAN·Filed 2015·Granted Aug 23, 2016·1 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →