Inventor · disambiguated record
Yuan-Li Liao
Also filed as: LIAO YUAN · LIAO YUAN-LI
8 granted patents·3 pending applications·45 citations·filing 2004–2023
81Inventor score
Files withDAXIN MATERIALS CORP3TAIWAN SEMICONDUCTOR MFG2TSAI MING-HAN2UNIV CITY HONG KONG2DAXIN MAT CORP1
Top patents by PatentIndex Score
11 records- 0188US7714145B22-2′-disubstituted 9,9′-spirobifluorene-base triaryldiamines and their applicationTSAI MING-HAN·Filed 2007·Granted May 11, 2010·19 cites·8 claims
- 0273US10703945B2Method for temporary bonding workpiece and adhesiveDAXIN MATERIALS CORP·Filed 2019·Granted Jul 7, 2020·2 cites·17 claims
- 0370US7266417B2System and method for semiconductor manufacturing automationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 4, 2007·16 cites·20 claims
- 0456US6872824B2Pyrimidine spirobifluorene oligomer for organic light-emitting deviceECHEM HIGHTECH CO LTD·Filed 2004·Granted Mar 29, 2005·8 cites·12 claims
- 0553US9306134B2Encapsulating composition and light emitting deviceDAXIN MATERIALS CORP·Filed 2014·Granted Apr 5, 2016·0 cites·15 claims
- 0647US2025199472A1Phase change material-based metasurface structure and related methodUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
- 0746US2024168437A1Metasurface structure and related article and methodUNIV CITY HONG KONG·Filed 2023·Application pending·0 cites
- 0842US2007262704A1Carbazole-based Compounds and Their ApplicationTSAI MING-HAN·Filed 2007·Application pending·0 cites
- 0941US12043770B2Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer packageDAXIN MATERIALS CORP·Filed 2019·Granted Jul 23, 2024·0 cites·6 claims
- 1041US11976018B2Diamine compound, method for manufacturing the same, and applications thereofDAXIN MAT CORP·Filed 2021·Granted May 7, 2024·0 cites·17 claims
- 1140US7225042B2Manufacturing procedure control method and systemTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 29, 2007·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →