Inventor · disambiguated record
Yu-Ju Liao
Also filed as: LIAO YU-JU
8 granted patents·4 citations·filing 2019–2022
75Inventor score
Files withADVANCED SEMICONDUCTOR ENG8
Top patents by PatentIndex Score
8 records- 0186US11335646B2Substrate structure including embedded semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted May 17, 2022·2 cites·21 claims
- 0274US11139179B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·2 cites·21 claims
- 0371US12469795B2Substrate structure including embedded semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Nov 11, 2025·0 cites·8 claims
- 0458US11848280B2Method for manufacturing assembly structure by using frame structure on substrateADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Dec 19, 2023·0 cites·19 claims
- 0553US10950551B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 0649US11296030B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 5, 2022·0 cites·18 claims
- 0748US11587881B2Substrate structure including embedded semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·0 cites·18 claims
- 0845US11277917B2Embedded component package structure, embedded type panel substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →