Inventor · disambiguated record
Yu-Jen Lien
Also filed as: LIEN YU-JEN
1 granted patent·8 pending applications·0 citations·filing 2021–2024
3Inventor score
Top patents by PatentIndex Score
9 records- 0159US2025246507A1Semiconductor device, semiconductor package and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0258US2025391726A1Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0358US2025357266A1Cooling system with integrated micro coolerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0456US2025218890A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0556US2025038073A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0656US2025167075A1Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0754US2024162109A1Package with Improved Heat Dissipation Efficiency and Method for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0849US11768166B2System and method for measuring void fraction of inside of heat conduction memberUNIV NAT TAIWAN·Filed 2021·Granted Sep 26, 2023·0 cites·14 claims
- 0948US2024128149A1Cooling interface region for a semiconductor die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →