Inventor · disambiguated record
Yueh-Ting Lin
Also filed as: LIN YUEH-TING
12 granted patents·4 pending applications·30 citations·filing 2006–2024
87Inventor score
Top patents by PatentIndex Score
16 records- 0195US11587900B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·3 cites·20 claims
- 0293US11177142B2Method for dicing integrated fan-out packages without seal ringsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 16, 2021·10 cites·20 claims
- 0392US12159853B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·1 cites·20 claims
- 0491US10672741B2Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 2, 2020·7 cites·17 claims
- 0589US10720409B2Semiconductor packages with thermal-electrical-mechanical chips and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·5 cites·20 claims
- 0680US12211782B2Semiconductor package dielectric susbtrate including a trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 0780US11088094B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 0880US2025125249A1Semiconductor package dielectric susbtrate including a trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0979US2025054894A1Package structure including ipd and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1078US11984410B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 1175US10867928B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·13 claims
- 1272US11961796B2Semiconductor package dielectric substrate including a trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 1372US11682637B2Air channel formation in packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 1454US2024055311A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1548US2007134126A1Method of inhibiting metal corrosionIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1640US10756037B2Package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →