Inventor · disambiguated record
Yung-Lung Lin
Also filed as: LIN YUNG-LUNG
41 granted patents·14 pending applications·250 citations·filing 2003–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD35TAIWAN SEMICONDUCTOR MFG9AU OPTRONICS CORP2LIN YUNG-LUNG2WANG WEI-YA2
Top patents by PatentIndex Score
55 records- 0198US11127635B1Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 21, 2021·12 cites·20 claims
- 0298US9704827B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·32 cites·20 claims
- 0396US12315843B2Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 27, 2025·2 cites·20 claims
- 0495US10395974B1Method for forming a thin semiconductor-on-insulator (SOI) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 27, 2019·11 cites·20 claims
- 0595US10050018B23DIC structure and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·12 cites·20 claims
- 0694US7701755B2Memory having improved power designTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Apr 20, 2010·41 cites·13 claims
- 0792US10727205B2Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·6 cites·20 claims
- 0890US11410972B2Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·2 cites·20 claims
- 0990US11322481B2Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 1089US10727218B2Seal ring structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·5 cites·20 claims
- 1187US11804473B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·1 cites·20 claims
- 1285US7468903B2Circuits for improving read and write margins in multi-port SRAMSTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Dec 23, 2008·18 cites·17 claims
- 1385US2024355784A1Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1484US12300670B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1584US10504716B2Method for manufacturing semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·3 cites·20 claims
- 1684US7319355B2Pulse generatorTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jan 15, 2008·14 cites·19 claims
- 1784US7103433B1Method for providing service for users to determine assembly match information of componentsIND TECH RES INST·Filed 2005·Granted Sep 5, 2006·22 cites·52 claims
- 1883US2025241053A1Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1982US10269770B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 2082US7688613B2Method and system for controlling multiple electrical fuses with one program deviceTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 30, 2010·13 cites·18 claims
- 2182US7271644B2Multi-state electrical fuseTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 18, 2007·14 cites·20 claims
- 2281US10522514B23DIC structure and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 2381US7505319B2Method and apparatus for high efficiency redundancy scheme for multi-segment SRAMTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 17, 2009·13 cites·31 claims
- 2480US12293946B2Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 2579US11984431B23DIC structure and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 2679US2025306270A1Photonic semiconductor-on-insulator (soi) substrate and method for forming the photonic soi substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2776US11545395B2Techniques for wafer stack processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 2874US11087971B2Method for manufacturing semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 2973US12360314B2Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 3073US2024198455A1Damage prevention during wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3172US12237165B2Method for wafer bonding including edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 3272US8223575B2Multi-level electrical fuse using one programming deviceLIN YUNG-LUNG·Filed 2007·Granted Jul 17, 2012·7 cites·19 claims
- 3371US11842992B2Seal ring structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 3469US10453832B2Seal ring structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 22, 2019·1 cites·20 claims
- 3566US11951569B2Damage prevention during wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 3665US7577052B2Power switching circuitTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 18, 2009·6 cites·18 claims
- 3764US11342322B2Seal ring structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 3863US11587908B23DIC structure and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 21, 2023·0 cites·20 claims
- 3963US11024602B2Hybrid bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 4062US2025364314A1Method of forming semiconductor-on-insulator (soi) substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4161US8619488B2Multi-level electrical fuse using one programming deviceLIN YUNG-LUNG·Filed 2012·Granted Dec 31, 2013·1 cites·19 claims
- 4261US2024161998A1Direct writing system used for electron beam lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4360US2022362903A1Multiple polishing heads with cross-zone pressure element distributions for cmpTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 4460US2025246558A1Semiconductor-on-insulator (soi) structure with variable resistivity epitaxial semiconductor layers and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4554US7535788B2Dynamic power control for expanding SRAM write marginTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted May 19, 2009·3 cites·13 claims
- 4652US8080881B2Contact pad supporting structure and integrated circuit for crack suppresionTSAO SHENG-HSIUNG·Filed 2009·Granted Dec 20, 2011·3 cites·18 claims
- 4749US8619220B2Liquid crystal display panel and color filterWANG WEI-YA·Filed 2012·Granted Dec 31, 2013·0 cites·6 claims
- 4848US8263173B2Liquid crystal display panel, color filter and manufacturing method thereofWANG WEI-YA·Filed 2007·Granted Sep 11, 2012·1 cites·18 claims
- 4945US9704820B1Semiconductor manufacturing method and associated semiconductor manufacturing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 11, 2017·0 cites·17 claims
- 5044US2005194216A1Self-lubricating device for use in an optical instrumentASUSTEK COMP INC·Filed 2005·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →