Inventor · disambiguated record
Yu-Wei Lin
Also filed as: LIN YU-WEI
53 granted patents·30 pending applications·341 citations·filing 2000–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD31LIN YU-WEI9DIODES INC6TAIWAN SEMICONDUCTOR MFG3GRAND TEK TECH CO LTD2
Top patents by PatentIndex Score
83 records- 0199US9236877B2Micro-electro-mechanical systems (MEMS), systems, and operating methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·49 cites·20 claims
- 0297US11101596B1Waterproof enhanced RF connectorGRAND TEK TECH CO LTD·Filed 2020·Granted Aug 24, 2021·9 cites·8 claims
- 0396US11903188B2Memory devices, semiconductor devices, and methods of operating a memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 0495US11489657B1Bit-level mode retimerDIODES INC·Filed 2021·Granted Nov 1, 2022·13 cites·25 claims
- 0595US7314820B2Carrier-free semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Jan 1, 2008·74 cites·18 claims
- 0694US7551043B2Micromechanical structures having a capacitive transducer gap filled with a dielectric and method of making sameUNIV MICHIGAN·Filed 2006·Granted Jun 23, 2009·38 cites·19 claims
- 0792US11600319B2Memory system capable of performing a bit partitioning process and an internal computation processUNIV NAT CHENG KUNG·Filed 2021·Granted Mar 7, 2023·3 cites·10 claims
- 0891US10879192B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·10 cites·13 claims
- 0991US10128195B2Substrate design with balanced metal and solder resist densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·6 cites·20 claims
- 1091US9496233B2Interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 15, 2016·7 cites·20 claims
- 1188US9153550B2Substrate design with balanced metal and solder resist densityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·7 cites·20 claims
- 1288US8629795B2Micro-electro-mechanical systems (MEMS), systems, and operating methods thereofPENG YUNG-CHOW·Filed 2010·Granted Jan 14, 2014·9 cites·20 claims
- 1388US2025357854A1Charge pump circuits with backside fly capacitors and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1486US9161465B2Quick-release fixing structure for electronic equipmentsCHEN CHIA-JUNG·Filed 2012·Granted Oct 13, 2015·12 cites·12 claims
- 1585US8584320B2Hinge mechanism and clamshell device thereofWISTRON CORP·Filed 2012·Granted Nov 19, 2013·9 cites·20 claims
- 1682US10020276B2Protrusion bump pads for bond-on-trace processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 10, 2018·3 cites·20 claims
- 1782US7911296B2Resonator system such as a microresonator system and method of making sameUNIV MICHIGAN·Filed 2008·Granted Mar 22, 2011·10 cites·26 claims
- 1879US2025351339A1One-time-programmable memory array having different device characteristics and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1978US9425117B2Substrate design with balanced metal and solder resist densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·2 cites·20 claims
- 2078US9111817B2Bump structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 18, 2015·2 cites·20 claims
- 2178US2025070658A1Charge pump circuits with backside fly capacitors and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2277US11961810B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2377US9508637B2Protrusion bump pads for bond-on-trace processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 29, 2016·3 cites·20 claims
- 2477US9184489B2Antenna fixing structureGRAND TEK TECHNOLOGY CO LTD·Filed 2014·Granted Nov 10, 2015·5 cites·9 claims
- 2577US8741448B2Fullerene derivatives and optoelectronic devices utilizing the sameCHEN CHIH-PING·Filed 2011·Granted Jun 3, 2014·5 cites·4 claims
- 2677US2025357260A1Heat dissipation for integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2775US12284804B2Memory devices, semiconductor devices, and methods of operations a memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 22, 2025·0 cites·20 claims
- 2874US6463013B1Clock generating apparatus and method thereofVIA TECH INC·Filed 2000·Granted Oct 8, 2002·22 cites·54 claims
- 2973US12176299B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 3073USD1040635STool handleLIN YU WEI·Filed 2022·Granted Sep 3, 2024·4 cites·1 claims
- 3173US2025048623A1One-time-programmable memory array having different device characteristics and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3271US12228962B1Clock signal skew calibration apparatus and control methodDIODES INC·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 3371US7758780B2Method of sensing melt-front position and velocityNAT UNIV CHUNG CHENG·Filed 2008·Granted Jul 20, 2010·6 cites·13 claims
- 3471US2025210450A1Heat dissipation for integrated circuit packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3568US11153982B2Rollable structure and electronic device using samePEGATRON CORP·Filed 2020·Granted Oct 19, 2021·1 cites·20 claims
- 3668US2025085345A1Data correction and phase optimization in high-speed receiversDIODES INC·Filed 2024·Application pending·0 cites
- 3768US2025147544A1Clock Signal Skew Calibration Apparatus and Control MethodDIODES INC·Filed 2025·Application pending·0 cites
- 3867US11043462B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 3967US9812405B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·1 cites·20 claims
- 4067US8823388B2Calibration circuit and calibration methodLIN YU-WEI·Filed 2011·Granted Sep 2, 2014·3 cites·8 claims
- 4167US2025115920A1Host cells and methods useful for producing calcium phosphate based composite biomaterialsUNIV CALIFORNIA·Filed 2024·Application pending·0 cites
- 4266US11736266B2Phase interpolator circuitry for a bit-level mode retimerDIODES INC·Filed 2022·Granted Aug 22, 2023·0 cites·10 claims
- 4364USD799454SAntenna housingGRAND-TEK TECH CO LTD·Filed 2016·Granted Oct 10, 2017·10 cites·1 claims
- 4464US6603300B2Phase-detecting deviceVIA TECH INC·Filed 2001·Granted Aug 5, 2003·13 cites·9 claims
- 4563US12181523B2Data correction and phase optimization in high-speed receiversDIODES INC·Filed 2022·Granted Dec 31, 2024·0 cites·24 claims
- 4661US11587887B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 4761US10319691B2Solderless interconnection structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 11, 2019·0 cites·20 claims
- 4861US8578559B2Hinge mechanism and clamshell device thereofLIN YU-WEI·Filed 2011·Granted Nov 12, 2013·1 cites·20 claims
- 4960US12179336B1Hand tool rackLIN YU WEI·Filed 2023·Granted Dec 31, 2024·0 cites·10 claims
- 5060US11953052B2Fastener and housing device including the fastenerPEGATRON CORP·Filed 2021·Granted Apr 9, 2024·0 cites·11 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →