Inventor · disambiguated record
Yu-Lun Lin
Also filed as: LIN YU-LUN
10 granted patents·7 pending applications·226 citations·filing 1997–2025
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG5SKY STATION INTERNATIONAL INC2TEXAS INSTRUMENTS INC2HER HONG-CHING1LIN YU-LUN1
Top patents by PatentIndex Score
17 records- 0194US6224016B1Integrated flexible solar cell material and method of productionSKY STATION INTERNATIONAL INC·Filed 1997·Granted May 1, 2001·131 cites·87 claims
- 0282US8042445B2Cutting mold for rigid-flexible circuit board and method for forming the sameNAN YA PRINTED CIRCUIT BOARD·Filed 2008·Granted Oct 25, 2011·13 cites·5 claims
- 0374US6498106B1Prevention of defects formed in photoresist during wet etchingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 24, 2002·19 cites·14 claims
- 0473US6808942B1Method for controlling a critical dimension (CD) in an etch processTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 26, 2004·20 cites·24 claims
- 0561US2025379011A1Keyswitch substrate with sensor systemLOGITECH EUROPE SA·Filed 2025·Application pending·0 cites
- 0658US2025006804A1Semiconductor device including an etch stop layer for contact hole formationTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0756US6184116B1Method to fabricate the MOS gateTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Feb 6, 2001·10 cites·34 claims
- 0854US2024262227A1Charging devicePEGATRON CORP·Filed 2023·Application pending·0 cites
- 0952US6203659B1Method and apparatus for controlling the quality of a photoresist stripper bathTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Mar 20, 2001·20 cites·4 claims
- 1045US6475917B1Method to reduce the metal TiN ARC damage in etching back processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Nov 5, 2002·12 cites·10 claims
- 1145US2008085020A1Vibration unitTSAI CHI-YI·Filed 2006·Application pending·0 cites
- 1241US2021387331A1Three-finger mechanical gripper system and training method thereofUNIV TAMKANG·Filed 2021·Application pending·0 cites
- 1340US6595370B2Apparatus and method for reducing contamination in a wafer transfer chamberTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 22, 2003·1 cites·20 claims
- 1438US2009026168A1Method for manufacturing a rigid-flex circuit boardTSAI TZONG-WOEI·Filed 2007·Application pending·0 cites
- 1537US8467565B2Inductive electroacoustic transducerHER HONG-CHING·Filed 2011·Granted Jun 18, 2013·0 cites·12 claims
- 1634US8833045B2Lawn mowerLIN YU-LUN·Filed 2011·Granted Sep 16, 2014·0 cites·6 claims
- 1729US2002005457A1Stratospheric vehicles with integrated flexible solar cell material and method of productionSKY STATION INTERNATIONAL INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →