Inventor · disambiguated record
Yu-Bin Lin
Also filed as: LIN YU-BIN
2 granted patents·4 pending applications·1 citations·filing 2013–2014
28Inventor score
Files withJIANGSU CHANGJIANG ELECTRONICS3JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD2EMINENT ELECTRONIC TECHNOLOGY CORP LTD1
Top patents by PatentIndex Score
6 records- 0155US2015171233A1Ultraviolet sensor, ultraviolet sensing apparatus, and sensing method for obtaining compensated ultraviolet sensing resultEMINENT ELECTRONIC TECHNOLOGY CORP LTD·Filed 2014·Application pending·0 cites
- 0250US9640413B2Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted May 2, 2017·1 cites·19 claims
- 0335US2016148861A1First-packaged and later-etched three-dimensional flip-chip system-in-package structure and processing method thereforJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites
- 0433US9633985B2First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2014·Granted Apr 25, 2017·0 cites·10 claims
- 0533US2016141233A1First-packaged and later-etched normal chip three dimension system-in-package metal circuit board structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2014·Application pending·0 cites
- 0633US2016163622A1Packaging-before-etching flip chip 3d system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →