Inventor · disambiguated record
Yung-Sheng Lin
Also filed as: LIN YUNG-SHENG
40 granted patents·27 pending applications·147 citations·filing 1998–2025
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD18ADVANCED SEMICONDUCTOR ENG7CHANG CHUN PLASTICS CO LTD7DELL PRODUCTS LP7LIN YUNG-SHENG7
Top patents by PatentIndex Score
67 records- 0195US7036787B1Display strut adjusting structureTAIWAN THICK FILM IND CORP·Filed 2005·Granted May 2, 2006·97 cites·4 claims
- 0294US12015002B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·2 cites·20 claims
- 0393US11994787B2Method and apparatus for closed-loop camera shutter control and remediation hardwareDELL PRODUCTS LP·Filed 2022·Granted May 28, 2024·2 cites·20 claims
- 0493US10450478B1Epoxy resin, aqueous dispersion and water-borne epoxy coating composition comprising the sameCHANG CHUN PLASTICS CO LTD·Filed 2019·Granted Oct 22, 2019·8 cites·14 claims
- 0587US12109669B2Pipe plier structureLIN YUNG SHENG·Filed 2022·Granted Oct 8, 2024·2 cites·4 claims
- 0687US2025364468A1Semiconductor device structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0786US2025343135A1Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0885US2025357145A1Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0984US12438048B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 1083US12463166B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 1183US10392504B2Reactive epoxy compounds and method for producing the same, core-shell type epoxy resin particles, waterborne epoxy resin composition, and coating composition containing the reactive epoxy compoundsCHANG CHUN PLASTICS CO LTD·Filed 2018·Granted Aug 27, 2019·1 cites·15 claims
- 1283US2025323201A1Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1382US12431365B2Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 1482US12412858B2Semiconductor device structure with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 1581US11669639B2System and method for multi-user state changeDELL PRODUCTS LP·Filed 2021·Granted Jun 6, 2023·1 cites·20 claims
- 1681US11387143B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·1 cites·20 claims
- 1781US8333018B2Composition for enhancing evaporation of solution and method thereofLIN YUNG-SHENG·Filed 2010·Granted Dec 18, 2012·5 cites·19 claims
- 1880US12009256B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 1979US12500149B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 2077US11721579B2Redistribution lines with protection layers and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 2173US12033870B2Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·20 claims
- 2271US11990440B2Structure and formation method of semiconductor device with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 2371US11854964B2Structure and formation method of semiconductor device with conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2469US11769716B2Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·0 cites·20 claims
- 2568US10246607B2Resin composition, coating composition and article by using the sameCHANG CHUN PLASTICS CO LTD·Filed 2018·Granted Apr 2, 2019·0 cites·19 claims
- 2663US12333314B2Systems and methods for configuration of a workspace based on short-range wireless location mapping in heterogeneous computing platformsDELL PRODUCTS LP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 2762US9630271B1Welding gun with evenly distributed gas pressureLIN YUNG-SHENG·Filed 2016·Granted Apr 25, 2017·1 cites·3 claims
- 2861US8409262B2Composition used for increasing calmodulin and method thereofLIN YUNG-SHENG·Filed 2009·Granted Apr 2, 2013·5 cites·9 claims
- 2960US12141519B2Systems and methods for managing text settings based upon user distance with heterogeneous computing platformsDELL PRODUCTS LP·Filed 2023·Granted Nov 12, 2024·0 cites·18 claims
- 3058US12064754B2Titanium catalyst and synthesizing polyester resinsUNIV NAT TSING HUA·Filed 2022·Granted Aug 20, 2024·0 cites·8 claims
- 3156US11065724B1Laser weldable compositions, products and uses thereofCHANG CHUN PLASTICS CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·18 claims
- 3256US10745556B1Amino resin composition and varnish, coating layer, and product comprising the sameCHANG CHUN PLASTICS CO LTD·Filed 2020·Granted Aug 18, 2020·0 cites·20 claims
- 3355US2025038106A1Bond structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3454US7645915B2Composite dressingMEDICAL & PHARM IND TECH & DEV·Filed 2007·Granted Jan 12, 2010·0 cites·20 claims
- 3554US2008311059A1Composition for skin care and method for the sameNAT APPLIED RES LABORATORIES·Filed 2007·Application pending·0 cites
- 3653US2021130645A1Compound, water-borne epoxy resin composition comprising the same, and coating composition comprising the water-borne epoxy resin compositionCHANG CHUN PLASTICS CO LTD·Filed 2020·Application pending·0 cites
- 3753US2010167400A1Composition for Increasing Intracellular Nitric Oxide and Method for the SameLEUNG TING-KAI·Filed 2007·Application pending·0 cites
- 3853US2024264885A1Systems and methods for managing notifications in response to multi-user detection in heterogeneous computing platformsDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 3953US2025210575A1Bonding structure and pre-bonding structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 4052US12057670B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 6, 2024·0 cites·19 claims
- 4152US11417539B2Bump structure and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 4252US7906155B2Method for increasing an amount of effective constituents from a plant in a solventNAT APPLIED RES LABORATORIES·Filed 2007·Granted Mar 15, 2011·0 cites·10 claims
- 4352US2009053287A1Porous dressingMEDICAL & PHARM IND TECH & DEV·Filed 2007·Application pending·0 cites
- 4452US2008189954A1Pipe cutterLIN YUNG SHENG·Filed 2006·Application pending·0 cites
- 4551US2024281357A1Systems and methods for managing user engagement, productivity, and wellness based upon contextual and telemetry data in heterogeneous computing platformsDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 4651US2024273208A1Systems and methods for interrupted workflow notification and performance management in heterogeneous computing platformsDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 4751US2010047310A1Bio-acceptable conduits and method providing the sameUNIV TAIPEI MEDICAL·Filed 2009·Application pending·0 cites
- 4850US11430761B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 30, 2022·0 cites·19 claims
- 4950US11257776B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Feb 22, 2022·0 cites·20 claims
- 5050US2008258351A1Equipment and method for electrospinningNAT APPLIED RES LABORATORIES·Filed 2007·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →