Inventor · disambiguated record
Yuan-Yi Lin
Also filed as: LIN YUAN-YI
19 granted patents·9 pending applications·15 citations·filing 2013–2023
88Inventor score
Files withASIA VITAL COMPONENTS CO LTD20ASIA VITAL COMPONENTS CHINA CO LTD4FOXLINK IMAGE TECH CO LTD4
Top patents by PatentIndex Score
28 records- 0193US12215934B2Thermal module structureASIA VITAL COMPONENTS CO LTD·Filed 2022·Granted Feb 4, 2025·2 cites·7 claims
- 0290US12446192B2Thermal moduleASIA VITAL COMPONENTS CO LTD·Filed 2021·Granted Oct 14, 2025·2 cites·7 claims
- 0384US10247488B2Heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2015·Granted Apr 2, 2019·5 cites·7 claims
- 0483US10813246B2Chassis heat dissipation structureASIA VITAL COMPONENTS CHINA CO LTD·Filed 2017·Granted Oct 20, 2020·4 cites·16 claims
- 0578US2023243597A1Heat sink assembly with heat pipeASIA VITAL COMPONENTS CO LTD·Filed 2022·Application pending·0 cites
- 0678US2023243603A1Heat sink structure with heat pipeASIA VITAL COMPONENTS CO LTD·Filed 2022·Application pending·0 cites
- 0776US12111113B2Heat transfer component reinforcement structureASIA VITAL COMPONENTS CO LTD·Filed 2019·Granted Oct 8, 2024·2 cites·2 claims
- 0872US12442600B2Thermal module assembling structureASIA VITAL COMPONENTS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·4 claims
- 0972US11719491B2Heat transfer member reinforcement structureASIA VITAL COMPONENTS CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·6 claims
- 1065US12510304B2Heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·5 claims
- 1161US11952230B2Thick document conveying deviceFOXLINK IMAGE TECH CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·12 claims
- 1258US12456658B2Knockdown heat sink structureASIA VITAL COMPONENTS CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·4 claims
- 1358US12241690B2Thermal module structureASIA VITAL COMPONENTS CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·5 claims
- 1456US12017879B2Paper blocking deviceFOXLINK IMAGE TECH CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·11 claims
- 1555US11917795B2Heat sink structureASIA VITAL COMPONENTS CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·8 claims
- 1655US2023241728A1Manufacturing method of thermal moduleASIA VITAL COMPONENTS CO LTD·Filed 2022·Application pending·0 cites
- 1755US2021123686A1Heat transfer member reinforcement structureASIA VITAL COMPONENTS CO LTD·Filed 2019·Application pending·0 cites
- 1853US10727154B2Component coupled to heat dissipation unitASIA VITAL COMPONENTS CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·1 claims
- 1950US2021025658A1Loop heat pipe structureASIA VITAL COMPONENTS CHINA CO LTD·Filed 2020·Application pending·0 cites
- 2050US2021025657A1Loop heat pipe structureASIA VITAL COMPONENTS CHINA CO LTD·Filed 2020·Application pending·0 cites
- 2148US11713202B2Foldable baffle structureFOXLINK IMAGE TECH CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·14 claims
- 2246US2017245395A1Component coupled to heat dissipation unitASIA VITAL COMPONENTS CO LTD·Filed 2016·Application pending·0 cites
- 2346US2019154352A1Loop heat pipe structureASIA VITAL COMPONENTS CHINA CO LTD·Filed 2017·Application pending·0 cites
- 2445US9989321B2Heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2014·Granted Jun 5, 2018·0 cites·4 claims
- 2542US9072176B2Assembling structure of heat dissipation deviceASIA VITAL COMPONENTS CO LTD·Filed 2013·Granted Jun 30, 2015·0 cites·8 claims
- 2641US10181093B2Scanning deviceFOXLINK IMAGE TECH CO LTD·Filed 2017·Granted Jan 15, 2019·0 cites·18 claims
- 2734US10021813B2Thermal module assembling structureASIA VITAL COMPONENTS CO LTD·Filed 2015·Granted Jul 10, 2018·0 cites·9 claims
- 2834US2017080533A1Heat dissipation device manufacturing methodASIA VITAL COMPONENTS CO LTD·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yuan-Yi Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →