Inventor · disambiguated record

Yusheng Lin

Also filed as: LIN YUSHENG

80 granted patents·42 pending applications·135 citations·filing 2014–2025

98Inventor score

Technology areasH10W H10P H01R H10D H01L

Files withSEMICONDUCTOR COMPONENTS IND LLC111 WOLFSPEED INC5 SEMICONDUCTOR COMPONENTS IND3 LEEDARSON LIGHTING CO LTD2 XIAMEN SOLEX HIGH TECH IND CO LTD1

Top patents by PatentIndex Score

122 records

0198US11955412B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 9, 2024·8 cites·19 claims
0298US11948870B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Apr 2, 2024·8 cites·19 claims
0398US11908840B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·8 cites·20 claims
0498US11894347B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 6, 2024·8 cites·20 claims
0598US11469163B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 11, 2022·8 cites·20 claims
0694US11075137B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 27, 2021·9 cites·21 claims
0794US9679878B1Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 13, 2017·9 cites·23 claims
0894US9640497B1Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 2, 2017·10 cites·15 claims
0993US11810775B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Nov 7, 2023·2 cites·18 claims
1092US11462515B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Oct 4, 2022·8 cites·12 claims
1191US12469709B2Semiconductor package electrical contact structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
1291US2025349550A1Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1391US2025349549A1Semiconductor devices having die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1491US2025336783A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1590US9691732B2Semiconductor package with elastic coupler and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 27, 2017·6 cites·13 claims
1690US2025323222A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1789US2025309199A1Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
1888US12374555B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
1988US10319652B2Semiconductor package with elastic coupler and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·5 cites·9 claims
2088US9905522B1Semiconductor copper metallization structure and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Feb 27, 2018·4 cites·13 claims
2187US12362266B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
2287US12347755B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
2387US11348878B2Reinforced semiconductor die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 31, 2022·2 cites·20 claims
2486US12355009B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
2586US12347812B2Low stress asymmetric dual side moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
2686US10290672B2Image sensor semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 14, 2019·5 cites·4 claims
2786US10186493B2Semiconductor copper metallization structure and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Jan 22, 2019·3 cites·14 claims
2886US9972607B2Semiconductor device and method of integrating power module with interposer and opposing substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 15, 2018·5 cites·21 claims
2985US9941257B2Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Apr 10, 2018·3 cites·20 claims
3085US9397017B2Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted Jul 19, 2016·5 cites·4 claims
3184US11646267B2Thinned semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 9, 2023·1 cites·19 claims
3284US9570832B2Press-fit pin for semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Feb 14, 2017·5 cites·20 claims
3383US12199041B2Thinned semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
3483US10991670B2Semiconductor device assemblies including spacer with embedded semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Apr 27, 2021·3 cites·21 claims
3582US11257759B1Isolation in a semiconductor deviceSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Feb 22, 2022·1 cites·20 claims
3681US11935817B2Power device module with dummy pad die layoutSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 19, 2024·1 cites·20 claims
3781US2025126853A1Monolithic semiconductor device assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
3879US12183785B2Monolithic semiconductor device assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
3979US12040192B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
4078US12414238B2Substrate structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
4178US9431311B1Semiconductor package with elastic coupler and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Aug 30, 2016·3 cites·6 claims
4278US2025149449A1Thinned semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4378US2025149450A1Thinned semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4477US2024355638A1Semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
4577US2025118640A1Multiple substrate package systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
4677US2025226264A1Fan-out wafer level packaging of semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
4776US12431359B2Semiconductor package electrical contacts and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Sep 30, 2025·0 cites·5 claims
4876US12293955B2High power module package structuresSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 6, 2025·0 cites·20 claims
4973US11791288B2Reinforced semiconductor die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
5073US2025232978A1Semiconductor package stress balance structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites

Showing the top 50 of 122 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →