Inventor · disambiguated record
Yueli Liu
Also filed as: LIU YUELI
15 granted patents·3 pending applications·107 citations·filing 2010–2024
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
18 records- 0197US9147663B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2013·Granted Sep 29, 2015·34 cites·6 claims
- 0296US9147638B2Interconnect structures for embedded bridgeINTEL CORP·Filed 2013·Granted Sep 29, 2015·51 cites·11 claims
- 0395US11694960B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2021·Granted Jul 4, 2023·2 cites·20 claims
- 0493US9640485B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2015·Granted May 2, 2017·8 cites·16 claims
- 0591US11133257B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2019·Granted Sep 28, 2021·4 cites·16 claims
- 0689US2025015004A1Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0784US9113573B2Molded insulator in package assemblyINTEL CORP·Filed 2012·Granted Aug 18, 2015·6 cites·19 claims
- 0883US12132002B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 0964US10475745B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2018·Granted Nov 12, 2019·0 cites·7 claims
- 1064US9412625B2Molded insulator in package assemblyINTEL CORP·Filed 2015·Granted Aug 9, 2016·1 cites·9 claims
- 1161US10103103B2Bridge interconnection with layered interconnect structuresINTEL CORP·Filed 2017·Granted Oct 16, 2018·0 cites·15 claims
- 1260US9502336B2Coreless substrate with passive device padsINTEL CORP·Filed 2013·Granted Nov 22, 2016·1 cites·11 claims
- 1357US9093313B2Device packaging with substrates having embedded lines and metal defined padsINTEL CORP·Filed 2014·Granted Jul 28, 2015·0 cites·3 claims
- 1453US9355952B2Device packaging with substrates having embedded lines and metal defined padsINTEL CORP·Filed 2015·Granted May 31, 2016·0 cites·14 claims
- 1548US2016336258A1Molded insulator in package assemblyINTEL CORP·Filed 2016·Application pending·0 cites
- 1645US10957667B2Indium solder metallurgy to control electro-migrationINTEL CORP·Filed 2016·Granted Mar 23, 2021·0 cites·23 claims
- 1743US8835217B2Device packaging with substrates having embedded lines and metal defined padsHLAD MARK S·Filed 2010·Granted Sep 16, 2014·0 cites·5 claims
- 1842US2015014852A1Package assembly configurations for multiple dies and associated techniquesLIU YUELI·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →